|
|
Electrochemical Corrosion Behaviors of the Galvanic Couple Cu/Sn63-Pb37 in simulated atmosphere |
;Chuanwei Yan; |
中国科学院金属研究所金属腐蚀与防护国家重点实验室 |
|
|
Abstract The Cu/Sn63-Pb37 galvanic couple appeared in most electronic devices. This paper was to investigate the corrosion characteristics and mechanisms of this couple, which was exposed in the typically simulated air condition at 40?C with 95%RH. The in-situ electrochemical information of the couple have been performed with related zero resistance ampere techniques under thin moisture film. According to the time dependent features of galvanic potential and anodic galvanic current density results, the Cu acted as anode and the Sn63-Pb37 acted as cathode during exposure. The gradual formed corrosion products, which were detected by FT-IR and XRD, restrained the anodic polarization behavior occurring on Cu surface. The hydrolyzed CO2 on the Sn63-Pb37 surface induced the breakdown of Pb oxides formed in air naturally, which was confirmed from the SEM surface morphologies.
Despite the exact corrosion rates was not obtained from the galvanic current density data, the changing trend were valuable for estimating the atmospheric corrosion behavior of the Cu/Sn63-Pb37 couple.
|
Received: 27 April 2006
|
|
[1]Guttenplan J D,Hashimoto L N.Corrosion control for electricalcontacts in submarine based electronic equipment[J].Mater.Perform.,1978,18(12):49-55 [2]Sinclair J D.Corrosion of electronics[J].J.Electrochem.Soc.,1988,135(3):89C-95C [3]Li Q.Corrosion of electronic materials[J].Electron.Compon.Mater.,1996,15(6):48-50(李青.电子材料的腐蚀[J].电子元件与材料,1996,15(6):48-50) [4]Aastrup T,Wadsak M,Shreiner M.Experimental in situ studiesof copper exposed to humidified air[J].Corros.Sci.,2000,42:957-967 [5]Shin B L,Young R Y,Ja Y J.Electrochemical migration charac-teristics of eutectic Sn Pb solder alloy in printed circuit board[J].Thin Solid Films,2006,504:294-297 [6]Manning M I.Atmospheric corrosion issues today[J].Industrial Corros.,1989,7(8):5-9 [7]Mattsson E.Corrosion:an electrochemical problem[J].Chem.Technol.,1985,4:234-243 [8]Cao C N.Electrochemical Corrosion Theory[M].Beijing:Chemi-cal Industry Press,2004(曹楚南.腐蚀电化学原理[M].北京:化学工业出版社,2004) [9]Mansfeld F,Kenkel J V.Galvanic corrosion of Al alloysⅢ.Theeffect of area ratio[J].Corros.Sci.,1975,15:239-250 [10]Xu J L,Li M Z.Research on electrochemical monitoring of at-mospheric corrosion[J].J.Chin.Soc.Corros.Prot.,1987,7(1):60-65(徐俊丽,李牧铮.大气腐蚀电化学监测的研究[J].中国腐蚀与防护学报,1987,7(1):60-65) [11]Zakipour S,Lygraf C.Evaluation of laboratory tests to simulateindoor corrosion of electrical contact materials[J].J.Electrochem.Soc.,1986,133(1):21-30 [12]Chen Z Y,Zakipour S,Persson D.The effects of sodium chlo-ride particles on the atmospheric corrosion of pure copper[J]Corrosion,2004,60(5):479-491 [13]Debiemme C,Ammeloo F,Sutter E M M.X-Ray photoemissioninvestigation of the corrosion film formed on a polished Cu-13Snalloy in aerated Na Cl solution[J].Appl.Surf.Sci.,2001,174:55-61 [14]Ryck I D,Biezen E V.Study of tin corrosion:the influence of al-loying elements[J].J.Cultural Heritage,2004,5:189-195 [15]Lu Y K.Thermodynamics of surface corrosion of solid pure lead、tin and their alloy[J].J.Univ.Sci.Technol.Beijing,1989,11(2):167-172(鲁永奎.固态铅、锡及其合金表面腐蚀热力学[J].北京科技大学学报,1989,11(2):167-172) |
No Suggested Reading articles found! |
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|