无铅焊料的腐蚀性能研究现状及展望

中国腐蚀与防护学报

2011, Vol. 31

Issue (4): 250-254

综述

本期目录 | 过刊浏览

无铅焊料的腐蚀性能研究现状及展望

王明娜¹,王俭秋¹,冯皓²,柯伟¹

1. 中国科学院金属研究所金属腐蚀与防护国家重点实验室沈阳 110016
2. 广州电器科学研究院工业产品环境适应性国家重点实验室广州 510300

CURRENT STATUS AND FUTURE OF RESEARCH ON CORROSION FOR LEAD-FREE SOLDER MATERIALS

WANG Mingna¹, WANG Jianqiu¹, FENG Hao², KE Wei¹

1. State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016
2. State Key Laboratory of Environment Adaptability for Industrial Products, China National Electric Apparatus Research Institute, Guangzhou 510300

全文: PDF(441 KB)

摘要: 就Sn-Ag、Sn-Cu、Sn-Ag-Cu和Sn-Zn几种主要的无铅焊料合金系阐述了当前对无铅焊料腐蚀性能的研究情况。指出当前研究只关注了焊料本体的腐蚀性能，而在焊接过程中焊料熔化和凝固后的微观结构和化学等将发生变化，这些对腐蚀有很大影响。提出进一步研究应关注实际焊点与服役环境的交互作用机制。。

关键词 ：无铅焊料, 腐蚀, 氧化

Abstract：Corrosion performance of Sn-Ag, Sn-Cu, Sn-Ag-Cu and Sn-Zn lead-free solders are examined in this paper. The previous investigations were only focused on the solder itself, however, during the soldering process the solder was melted and then solidified. Compared to original solder material, the microstructure and chemistry of the solidified solder may change, which will affect the corrosion behavior of the solder during service in aggressive environment. So the investigation in the future should focus on the corrosion behavior of the solder joint used in aggressive environment.

Key words： lead-free solder corrosion oxidation

收稿日期: 2010-05-21

ZTFLH:

TG172

基金资助:

广州电器科学研究院工业产品环境适应性国家重点实验室资助

通讯作者: 王俭秋 E-mail: wangjianqiu@imr.ac.cn

Corresponding author: Ming-Na WANG E-mail: wangjianqiu@imr.ac.cn

作者简介: 王明娜，女，1982年生，博士生，研究方向为无铅焊料的腐蚀行为

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引用本文:

王明娜,王俭秋,冯皓,柯伟. 无铅焊料的腐蚀性能研究现状及展望[J]. 中国腐蚀与防护学报, 2011, 31(4): 250-254.
YU Meng-Na, YU Jian-Qiu. CURRENT STATUS AND FUTURE OF RESEARCH ON CORROSION FOR LEAD-FREE SOLDER MATERIALS. J Chin Soc Corr Pro, 2011, 31(4): 250-254.

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y2011/V31/I4/250

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