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Journal of Chinese Society for Corrosion and protection  2016, Vol. 36 Issue (2): 157-164    DOI: 10.11902/1005.4537.2015.053
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Effect of Vibrio Neocaledonicus sp. on Corrosion Behavior of Copper in Artificial Sea Water
Tao YAN1,2,Zhenlun SONG2,Moradi Masoumeh2,Lijing YANG2(),Tao XIAO1,2,Lifeng HOU1()
1. College of Material Science and Engineering, Taiyuan University of Technology, Taiyuan 030024,China
2. Key Laboratory of Marine New Materials and Related Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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Abstract  

In our previous research, the corrosion inhibitory effect of marine Vibrio neocaledonicus sp. bacterium was introduced for the first time. EIS results showed that the corrosion resistance of carbon steel increased by more than sixty fold in the presence of this bacteria. The aim of this paper is the investigation of bacterial influence on the corrosion process of unalloyed copper. Different electrochemical measures (open circuit potential, electrochemical impedance spectroscopy (EIS), and potentiodynamic polarization measurements) and surface analysis techniques (field emission scanning electron microscopy (FESEM) and confocal laser scanning microscopy (CLSM)) were used. The results showed that: in the presence of bacteria, EOCP (open circuit potential) of copper shifted to negative direction about 500 mV/(vs SCE); while the charge transfer resistance (Rct) and the corrosion current density (Icorr) increased and decreased respectively. These results confirmed that the Vibrio neocaledonicus sp. could lessen the corrosion of unalloyed copper. CLSM images showed bacteria could adsorbed on the copper easily, but no obvious biofilm were found on the copper surface. So, it seems the corrosion inhibition of the bacteria is due to bacterial attachment in the first hours of exposure. The mechanism has been discussed in this paper.

Key words:  copper      Vibrio neocaledonicus.sp.      adsorption      corrosion inhibition     

Cite this article: 

Tao YAN,Zhenlun SONG,Moradi Masoumeh,Lijing YANG,Tao XIAO,Lifeng HOU. Effect of Vibrio Neocaledonicus sp. on Corrosion Behavior of Copper in Artificial Sea Water. Journal of Chinese Society for Corrosion and protection, 2016, 36(2): 157-164.

URL: 

https://www.jcscp.org/EN/10.11902/1005.4537.2015.053     OR     https://www.jcscp.org/EN/Y2016/V36/I2/157

Fig.1  Growth cycle of bacteria in culture medium
Condition Time
d
Initial
mass / g
Final
mass / g
Mass
loss / g
Corrosion rateg / (m2h) η
2 11.4659 11.4636 0.0023 0.0568 ---
Without bacteria 5 13.2491 13.2420 0.0071 0.0709 ---
10 12.1149 12.1008 0.0141 0.0697 ---
2 12.0927 12.0921 0.0006 0.0148 0.26
With bacteria 5 12.5334 12.5327 0.0007 0.0069 0.10
10 13.2878 13.2869 0.0009 0.0044 0.06
Table 1  Mass loss of copper after immersion in the solution with and without bacterium
Fig.2  OCP of copper during immersion in media with and without bacteria
Fig.3  EIS plots of copper immersed in the solution with bacteria for different time: (a) Nyquist diagrams, (b) Bode modulus diagrams, (c) Bode phase angle diagrams
Fig.4  EIS plots of copper immersed in the solution without bacteria for different time: (a) Nyquist diagrams, (b) Bode modulus diagrams, (c) Bode phase angle diagrams
Fig.5  Equivalent circuit models of copper immersed in the solutions without (a) and with (b) bacteria
Condition Time
d
Rs
Ωcm2
Y01
μSsecncm-2
Rf
Ωcm2
Rct
kΩcm2
Y02
μSsecncm-2
0 2.56 56.01 21.99 0.86 361.8
Without bacteria 2 1.67 479.70 15.92 1.95 389.5
5 5.75 332.10 21.62 4.54 268.7
10 5.50 105.10 223.40 0.94 503.6
With bacteria 2 2.81 25.84 135.00 250.90 55.4
5 3.86 24.35 110.60 276.20 54.5
10 2.91 24.08 106.20 113.50 58.9
Table 2  Fitting parameters of EIS for copper immersed in the solutions with and without bacteria for different time
Fig.6  Polarization curves of copper immersed in media without (a) and with (b) bacteria for different time
Fig.7  CLSM images of copper immersed in the solution with bacteria for 1 d (a) and 10 d (b)
Fig.8  SEM images of copper after immersion in the solutions without (a) and with (b) bacteria for 10 d
Fig.9  SEM images of the Cu deposited Si wafer after immersion in the solution with bacteria for 1 d (a), 2 d (b) and 5 d (c)
Condition Time / d C P O N Cu Cl S Mg Si
1 0.14 3.28 9.49 --- 87.08 --- --- --- ---
With bacteria 2 0.03 13.39 17.58 --- 67.00 --- 2.00 --- ---
5 0.89 0.88 20.73 12.03 48.42 9.82 7.23 --- ---
1 --- --- 6.07 --- 91.70 2.23 --- --- ---
Without bacteria 2 --- --- 29.55 --- 56.31 1.48 --- 12.66 ---
5 --- --- 34.02 --- 45.32 --- --- 16.62 4.04
Table 3  EDS results of Cu deposited Si wafer after immersion in the solutions with bacteria for different time (mass fraction / %)
Fig.10  Schematic illustrations of bacterial adhesion and biofilm formation on copper
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