Cu/Ag活化对微弧氧化涂层表面化学镀层生长及耐蚀性能的影响

doi:10.11902/1005.4537.2021.151

中国腐蚀与防护学报

2022, Vol. 42

Issue (4): 573-582 DOI: 10.11902/1005.4537.2021.151

研究报告

本期目录 | 过刊浏览

Cu/Ag活化对微弧氧化涂层表面化学镀层生长及耐蚀性能的影响

田卫平¹, 郭良帅²^,³, 王宇航³, 周鹏³, 张涛³(

)

^1.航空工业庆安集团有限公司西安 710077
^2.天津航天长征火箭制造有限公司天津 300462
^3.沈阳材料科学国家研究中心东北大学联合研究分部沈阳 110819

Effect of Cu-/Ag-activation on Growth and Corrosion Resistance of Electroless Plated Ni-film on Plasma Electrolytic Oxidation Coating

TIAN Weiping¹, GUO Liangshuai²^,³, WANG Yuhang³, ZHOU Peng³, ZHANG Tao³(

)

^1.Qingan Group Co. Ltd., Xi'an 710077, China
^2.Tianjin Aerospace Long March Rocket Manufacturing Co. Ltd., Tianjin 300462, China
^3.Shenyang National Laboratory for Materials Science, Northeastern University, Shenyang 110819, China

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摘要:

微弧氧化 (PEO) 涂层属于陶瓷性涂层,表面不具有催化活性,需使用金属Pd活化后,再进行化学镀镍。为替代昂贵的Pd活化工艺,分别开发了Cu活化和Ag活化方法。利用场发射扫描电镜对浸镀后Cu/Ag活化复合涂层的镀层表面和截面形貌观察可见,Ag活化后PEO涂层表面镀层更加均匀致密,且厚度更大。经电化学测试表明,Ag活化复合涂层与传统Pd活化复合涂层的耐蚀性能相近,且明显优于Cu活化复合涂层。因此,Ag活化方法在保证复合涂层的耐蚀性能的同时,降低了活化成本。

关键词 ： AZ91D镁合金, Cu/Ag活化, 微弧氧化, 化学镀, 复合涂层

Abstract：

The plasma electrolytic oxidation (PEO) coating is a ceramic-like coating without catalytic activity of its surface, thus which should be activated with noble metal Pd before an electroless nickel (EN) plating process can be conducted. To replace the expensive Pd-activation process, Cu-activation and Ag-activation methods were developed. A field emission-scanning electron microscopy was employed to characterize the surface morphology and cross-section morphology of EN films on the Cu- and Ag-activated PEO coatings. In comparison with the Cu-activated PEO coating, a thicker, compact and more uniform EN layer film was formed on the Ag-activated PEO coating. Moreover, the results of electrochemical tests shown that the EN film plated on Ag-activated coating presents more or less the same corrosion resistance as the EN film plated on Pd-activated PEO coating, and better than the EN film plated on Cu-activated PEO coating. Hence, the Ag-activation method significantly reduce the cost, and best of all, it guaranteed the corrosion resistance of the composite coating.

Key words： AZ91D Mg alloy Cu/Ag activation plasma electrolytic oxidation electroless plating composite coating

收稿日期: 2021-06-29

ZTFLH:

TG172

基金资助:国家自然科学基金(51771050);国家自然科学基金(51531007);兴辽英才计划(XLYC2002071)

通讯作者: 张涛 E-mail: zhangtao@mail.neu.edu.cn

Corresponding author: ZHANG Tao E-mail: zhangtao@mail.neu.edu.cn

作者简介: 田卫平,男,1975年生,硕士,工程师

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引用本文:

田卫平, 郭良帅, 王宇航, 周鹏, 张涛. Cu/Ag活化对微弧氧化涂层表面化学镀层生长及耐蚀性能的影响[J]. 中国腐蚀与防护学报, 2022, 42(4): 573-582.
Weiping TIAN, Liangshuai GUO, Yuhang WANG, Peng ZHOU, Tao ZHANG. Effect of Cu-/Ag-activation on Growth and Corrosion Resistance of Electroless Plated Ni-film on Plasma Electrolytic Oxidation Coating. Journal of Chinese Society for Corrosion and protection, 2022, 42(4): 573-582.

链接本文:

https://www.jcscp.org/CN/10.11902/1005.4537.2021.151 或 https://www.jcscp.org/CN/Y2022/V42/I4/573

图1 PEO涂层的宏观形貌,表面SEM像和截面SEM像

图2 Cu敏化和Cu活化处理后PEO涂层的表面宏观形貌和SEM像

表1 EDS分析结果

图3 经Cu活化处理后PEO涂层表面主要元素分布图

图4 Ag敏化和Ag活化处理后PEO涂层的表面宏观形貌和SEM像

图5 Ag活化处理后PEO涂层表面主要元素分布图

图6 PEO涂层及不同活化处理后PEO涂层的XRD图谱

图7 经过不同敏化/活化处理后,PEO涂层的XPS图谱

图8 Cu/Ag/Pd活化处理后浸镀3、10和30 min后镀层表面和浸镀30 min后镀层截面的SEM像

图9 PEO-Cu-EN、PEO-Ag-EN和PEO-Pd-EN复合涂层的XRD图谱

图10 镁合金及不同涂层的动电位极化测试曲线

表2 图10中动电位极化曲线的拟合结果

图11 镁合金及不同涂层的电化学阻抗谱

图12 拟合电化学阻抗谱的等效电路

表3 电化学阻抗谱的拟合结果

图13 两种涂层在中性盐雾过程中的宏观形貌

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