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Journal of Chinese Society for Corrosion and protection  2014, Vol. 34 Issue (6): 558-565    DOI: 10.11902/1005.4537.2013.184
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Corrosion Resistance of Copper-bearing Duplex Stainless Steel in Culture Medium without and with Bacteria
WANG Yongxia, XIANG Hongliang, YANG Caiping, LIU Dong
School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350116, China
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Abstract  

Effects of aging treatment at 540~580 ℃ on the corrosion resistance of a copper-bearing duplex stainless were studied by electrochemical measurement in culture medium with and without bacteria. The surface morphology of the biofilms and the corrosion products formed on the steels solution treated and aging treated at 560 ℃ were characterized by OM and XPS. The results show that in the culture medium without bacteria, but the proportion of coarse copper-rich phase in the corrosion products on the aged steel increases with the increasing aging temperature, correspondingly the corrosion resistance of the aged steels became worse; in comparison with those in the culture medium without bacteria, the corrosion resistance of the steels solution treated and aged at 540 ℃ is inferior, while of the steels aged at 560 and 580 ℃ is better in the culture medium with bacteria, correspondingly a thicker porous microbiological biofilm with low CuCO3 content formed on the steel solution treated in the culture medium with bacteria, which possessed less protectiveness, while a thin and dense biofilm with high CuCO3 content formed on the steel aged at 560 ℃, which could enhance the corrosion resistance of the steel.
Key words:  copper-bearing duplex stainless steel      aged temperature      copper-rich phase      microbiological biofilm     
ZTFLH:  TG172  
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Yongxia WANG
Hongliang XIANG
Caiping YANG
Dong LIU

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WANG Yongxia, XIANG Hongliang, YANG Caiping, LIU Dong. Corrosion Resistance of Copper-bearing Duplex Stainless Steel in Culture Medium without and with Bacteria. Journal of Chinese Society for Corrosion and protection, 2014, 34(6): 558-565.

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https://www.jcscp.org/EN/10.11902/1005.4537.2013.184     OR     https://www.jcscp.org/EN/Y2014/V34/I6/558

Fig.1  Polarization curves of samples in culture medium without (a) and with (b) bacteria
Sample Icorr / Acm-2 Eb (vs SCE) / V
Solution treatment without bacteria 1.083×10-7 0.254
Aging at 540 ℃ without bacteria 2.238×10-7 0.249
Aging at 560 ℃ without bacteria 2.413×10-6 0.752
Aging at 580 ℃ without bacteria 3.500×10-6 0.046
Solution treatment without bacteria 3.667×10-7 0.837
Aging at 540 ℃ without bacteria 3.705×10-6 0.596
Aging at 560 ℃ without bacteria 2.706×10-7 1.169
Aging at 580 ℃ without bacteria 3.433×10-6 1.125
Table 1  Test parameters of the potentiodynamic polarization curves
Fig.2  Nyquist plots and simulate curves of samples in culture medium without (a) and with (b) bacteria
Fig.3  Electrical equivalent circuit model of Nyquist plot in Fig.2
Sample RS / Ωcm2 Cf / Ssecncm-2 n1 Rf / Ωcm2 Cp / Ssecncm-2 n2 RP / Ωcm2
Solution treatment without bacteria 11.2400 3.252×10-5 0.879 9.969×106 1.760×10-4 0.860 176.93
Aging at 540 ℃ without bacteria 12.2300 3.952×10-5 0.849 5.332×106 2.087×10-4 0.844 115.60
Aging at 560 ℃ without bacteria 13.8500 1.126×10-3 0.859 2.831×104 9.371×10-3 0.849 52.38
Aging at 580 ℃ without bacteria 14.5700 5.854×10-2 0.893 2.132×103 3.331×10-2 0.906 9.45
Solution treatment with bacteria 0.8307 1.338×10-4 0.875 3.684×105 7.794×10-4 0.881 84.19
Aging at 540 ℃ with bacteria 0.7517 1.051×10-2 0.854 1.667×103 2.617×10-2 0.922 6.69
Aging at 560 ℃ with bacteria 0.6437 6.276×10-5 0.929 4.105×105 5.428×10-4 0.901 89.59
Aging at 580 ℃ with bacteria 0.7632 1.106×10-3 0.856 1.848×104 9.551×10-2 0.900 33.76
Table 2  Values of fit parameter of EIS in Rs(QfRf)(QpRp) equivalent circuits
Fig.4  TEM images of samples aged at 540 ℃ (a), 560 ℃ (b) and 580 ℃ (c)
Fig.5  OM images of samples treated by solid solution (a) and aging at 560 ℃ after immersion in culture medium with bacteria (b)
Sample pH
Original 		pH
After 24 h 		Bacteria count, cfu/mL Original Bacteria count, cfu/mL
After 24 h
Solution treatment without bacteria 7.4~7.6 7.4~7.6 --- ---
Aging at 540 ℃ without bacteria 7.4~7.6 7.4~7.6 --- ---
Aging at 560 ℃ without bacteria 7.4~7.6 7.4~7.6 --- ---
Aging at 580 ℃ without bacteria 7.4~7.6 7.4~7.6 --- ---
Solution treatment with bacteria 7.4~7.6 6.4~6.5 2.8×108 1.18×108
Aging at 540 ℃ with bacteria 7.4~7.6 6.4~6.6 2.8×108 0.70×108
Aging at 560 ℃ with bacteria 7.4~7.6 6.7~7.0 2.8×108 1.12×105
Aging at 580 ℃ with bacteria 7.4~7.6 6.7~6.8 2.8×108 1.29×107
Table 3  pH and bacteria content of culture medium
Fig.6  XPS patterns of Cu2p3/2 in the passive film of samples after immersion in culture medium with bacteria: (a) solution treatment, (b) aging at 560 ℃
Sample Sputtering time / s 932.6 eV
(Cu) 		933.7 eV
(CuO) 		934.8 eV
(CuCO3) 		935.1 eV
(Cu(OH)2)
Solution treatment with bacteria 0 52.50 16.87 30.05 0.58
20 99.54 0.46 --- ---
30 92.64 --- --- 7.36
Aging at 560 ℃ with bacteria 0 --- 37.09 62.91 ---
20 89.71 10.29 --- ---
30 100 --- --- ---
Table 4  Binding energies and relative cotents of Cu2p3/2
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