<strong>5,5-</strong>二甲基乙内酰脲配位体系中银的电沉积行为研究

doi:10.11902/1005.4537.2022.262

中国腐蚀与防护学报

2023, Vol. 43

Issue (4): 896-902 CSTR: 32134.14.1005.4537.2022.262 DOI: 10.11902/1005.4537.2022.262

研究报告

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5,5-二甲基乙内酰脲配位体系中银的电沉积行为研究

陈惠敏¹, 王帅星¹(

), 张骐², 詹中伟², 杜楠¹

^1.南昌航空大学材料科学与工程学院南昌 330063
^2.中国航发北京航空材料研究院航空材料先进腐蚀与防护航空科技重点实验室北京 100095

Electrodeposition Behavior of Silver in an Alkaline DMH Plating Bath with 5,5-Dimethylhydantoin as Complexing Agent

CHEN Huimin¹, WANG Shuaixing¹(

), ZHANG Qi², ZHAN Zhongwei², DU Nan¹

^1.School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China
^2.Aviation Key Laboratory of Science and Technology on Advanced Corrosion and Protection for Aviation Material, AECC Beijing Institute of Aeronautical Materials, Beijing 100095, China

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摘要:

选用5,5-二甲基乙内酰脲 (DMH) 作为配位剂进行电镀银，通过计时电位曲线、阴极极化曲线、电化学阻抗谱等分析了碱性DMH镀银体系中银的阴极还原过程，采用循环伏安曲线、计时电流法研究了银的成核/生长机制，综合探讨了碱性DMH镀银体系中银的电沉积行为。结果表明，碱性DMH镀银体系中，银配离子的主要存在形式为[Ag(C₅H₇N₂O₂)₂]^-，并且通过前置转化反应生成[Ag(C₅H₇N₂O₂)]在阴极上直接放电。该体系中银的电沉积过程是由扩散控制的不可逆电极反应，且经历了晶核形成过程，并遵循三维瞬时成核生长机理。

关键词 ： 5,5-二甲基乙内酰脲, 银, 电沉积, 形核机理

Abstract：

Electroplating silver is carried out in an alkaline DMH plating bath with 5,5-dimethylhydantoin (DMH) as complexing agent. The cathodic reduction process of silver from alkaline DMH plating bath is analyzed by chronopotentiometry, cathodic polarization curve and electrochemical impedance spectroscopy (EIS), meanwhile, the nucleation/growth mechanism of silver are also studied by cyclic voltammetry and chronoamperometry, finally the electrodeposition behavior of silver in alkaline DMH complex system is comprehensively discussed. The results show that the main form of silver complex ions in the alkaline DMH plating system is [Ag(C₅H₇N₂O₂)₂]^-, which is converted to [Ag(C₅H₇N₂O₂)] through a preceding reaction and discharged directly on the cathode. The electrodeposition process of silver in this system is an irreversible electrode reaction controlled by diffusion step. Besides, the electrodeposition of silver undergoes a nucleation process and follows a three-dimensional transient nucleation mechanism.

Key words： 5,5-dimethylhydantoin silver electrodeposition nucleation mechanism

收稿日期: 2022-08-27 32134.14.1005.4537.2022.262

ZTFLH:

TG179

基金资助:江西省主要学科学术和技术带头人培养计划(20204BCJL23033);中国航空发动机集团产学研合作项目(HFZL2020CXY026);江西省研究生创新基金(YC2021-S654)

通讯作者: 王帅星，E-mail: wsxxpg@126.com，研究方向为航空材料表面处理及电化学加工

Corresponding author: WANG Shuaixing, E-mail: wsxxpg@126.com

作者简介: 陈惠敏，女，1998年生，硕士生

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引用本文:

陈惠敏, 王帅星, 张骐, 詹中伟, 杜楠. 5,5-二甲基乙内酰脲配位体系中银的电沉积行为研究[J]. 中国腐蚀与防护学报, 2023, 43(4): 896-902.
CHEN Huimin, WANG Shuaixing, ZHANG Qi, ZHAN Zhongwei, DU Nan. Electrodeposition Behavior of Silver in an Alkaline DMH Plating Bath with 5,5-Dimethylhydantoin as Complexing Agent. Journal of Chinese Society for Corrosion and protection, 2023, 43(4): 896-902.

链接本文:

https://www.jcscp.org/CN/10.11902/1005.4537.2022.262 或 https://www.jcscp.org/CN/Y2023/V43/I4/896

图1 平衡电势Ee与lnc (C5H7N2O2-)的关系曲线

图2 碱性DMH体系中银电沉积的计时电位曲线

图3 Iτ1/2～i关系曲线

图4 不同DMH含量下镀液的阴极极化曲线

图5 -0.50 V电位条件下lnI与ln[c(C5H7N2O )]的关系曲线

图6 玻碳电极上Ag沉积的循环伏安曲线

表1 不同扫描速度下的循环伏安曲线数据

图7 不同沉积电位下银沉积过程的电化学阻抗谱

图8 碱性DMH体系中银电沉积的电流密度-时间暂态曲线

图9 电流-时间暂态曲线的无因次曲线图

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