Sn-0.7Cu焊料在覆Cu FR-4 PCB板上电化学腐蚀及枝晶生长行为研究

中国腐蚀与防护学报

2010, Vol. 30

Issue (6): 469-474

研究报告

本期目录 | 过刊浏览

Sn-0.7Cu焊料在覆Cu FR-4 PCB板上电化学腐蚀及枝晶生长行为研究

华丽^1,2,郭兴蓬¹,杨家宽²

1. 华中科技大学化学与化工学院武汉 430074
2. 华中科技大学环境科学与工程学院武汉 430074

ELECTROCHEMICAL CORROSION BEHAVIOR AND DENDRITE GROWTH OF Sn-0.7Cu SOLDER ON FR-4 PRINTED CIRCUIT BOARD PLATED WITH Cu

HUA Li^1,2, GUO Xingpeng¹, YANG Jiakuan²

1. School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074
2. School of Environmental Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074

全文: PDF(3889 KB)

摘要: 用动电位扫描结合EDAX、XRD和SEM研究无铅焊料Sn-0.7Cu在覆Cu FR-4基板上于3.5 mass%NaCl溶液中电化学腐蚀行为及枝晶生长过程。结果显示，Sn-0.7Cu钎料腐蚀主要以共晶组织中Sn腐蚀为主；且随着电场强度增大，腐蚀电流密度增大，低电场为均匀腐蚀，高电场时有不均匀腐蚀发生。钎料枝晶生长引起“桥连”短路问题严重影响电子产品可靠性，EDAX分析表明，枝晶上Cu离子含量大于Sn离子，说明Cu离子的电化学迁移能力和还原沉积能力大于Sn。枝晶生长是螺旋式从内到外沿四个方向最快伸展的生长方式，晶粒形成存在一定取向，主要为(411)和(220)；电场强度越大，枝晶生长速率越快，桥连时间愈短；当阴、阳间距为3 mm时，两极桥连时间分别为 12.5 h（8 V），20.4 h（5 V），28.5 h（3 V），39.6 h（1 V）。XRD结果显示其腐蚀产物主要为：SnO₂，SnCl₄；枝晶组成主要为：Sn，SnO₂， SnCl₄，Cu，CuCl₂。

关键词 ： Sn-Cu钎料, 腐蚀行为, 枝晶生长, 动电位扫描, SEM, EDAX, XRD

Abstract：Electrochemical corrosion characteristics and dendrites growth of lead-free Sn-0.7Cu solder on FR-4 printed circuit board plated with Cu were investigated by potentiodynamic polarization coupled with scanning electron microscope, energy dispersion X-ray analysis and X-ray diffraction analysis. The results showed that the corroded metal in solder alloy was primarily Sn, and the corrosive current density increased with electric field intensity increasing. In low electric field, uniform corrosion took place, while in high electric field, the inhomogeneous corrosion existed. “Bridge interconnection” caused by dendrite growth severely impacted on the reliability of electronic products due to short circuit. Results of EDAX analysis indicated that on dendrites the content of Cu was larger than Sn, which implied the electromigration and deoxidization capacity of Cu²⁺ were larger than those of Sn²⁺. There was crystal tropism characteristics for dendrite growth: the orientations with fastest growth rate were from four directions, the growth was spiraled from inter to outer, and the favor tropisms of crystal particles on dendrites were (411) and (220). The stronger the electric field intensity, the faster the growth of dendrites, the shorter the bridge time. The bridge time of two electrodes with 3 mm fine-pitch after dendrite growth was respectively 12.5 h for 8 V, 20.4 h for 5 V, 28.5 h for 3 V, and 39.6 h for 1 V. XRD showed that the primary corrosive products were SnO₂，SnCl₄, while the contents on dendrites were Sn，SnO₂，SnCl₄，Cu，CuCl₂.

Key words： Sn-Cu solder corrosion behavior dendrite growth potentiodynamic polarization SEM EDAX XRD

收稿日期: 2009-10-16

ZTFLH:

O646.6

基金资助:

国家自然科学基金项目(50671040和50871044），湖北省教育厅高校产学研合作重点项目（C2010071），湖北第二师范学院中青年创新团队建设计划项目，湖北省教育厅重点项目（D20093103）和湖北第二师范学院校级重点项目（2009A005）资助

通讯作者: 郭兴蓬 E-mail: guoxp@mail.hust.edu.cn

Corresponding author: GUO Xingpeng E-mail: guoxp@mail.hust.edu.cn

作者简介: 华丽，女，1974年生，博士后，研究方向为金属腐蚀与防护

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引用本文:

华丽,郭兴蓬,杨家宽. Sn-0.7Cu焊料在覆Cu FR-4 PCB板上电化学腐蚀及枝晶生长行为研究[J]. 中国腐蚀与防护学报, 2010, 30(6): 469-474.
GUO Xin-Peng, HUA Li. ELECTROCHEMICAL CORROSION BEHAVIOR AND DENDRITE GROWTH OF Sn-0.7Cu SOLDER ON FR-4 PRINTED CIRCUIT BOARD PLATED WITH Cu. J Chin Soc Corr Pro, 2010, 30(6): 469-474.

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https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y2010/V30/I6/469

[1] Xu A B, Zheng T G. Corrosive failure of PCB and its failure analysis [J]. Electron. Prod. Reliabil.Environ. Testing, 2005, 23(2): 28-30

    (徐爱斌, 郑廷圭. PCB的腐蚀失效及其分析 [J]. 电子产品可靠性与环境试验. 2005, 23(2): 28-30)

[2] Sabbar A, Hajjaji S E, Bachir A B, et al. Evaluation of corrosion behavior of a new class of Pb-free solder materials (Sn-In-Zn) [J]. Mater. Corros., 2001, 52: 298-301

[3] Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment [J], Off. J. Eur. Union,2003, 27(1): 19-37

[4] European Parliament/Council of the European Union. Directive 2002/96/EC of the European Parliament and of the Council on waste electrical and electronic equipment [J]. off.J. Eur. Union, 2003, (27)1: 24-37

[5] Bernard T, Bergmann H W, Haberling C, et al. Joining technologies for Al-foam-Al-sheet compound structures [J]. Adv. Eng. Mater.,2002, (10)4: 798-802

[6] Yi L, Wong C P. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging:Materials, processing, reliability and applications [J]. Mater. Sci.Eng., 2006, R51: 1-35

[7] Tu K N. Electromigration in stressed thin films [J]. Phys. Rev., 1992, B45: 1409-1413

[8] Tu K N, Yeh C C, Liu C Y, et al. Effect of current crowding on vacancy diffusion and void formation in electromigration [J]. Appl. Phys. Lett., 2000, 76:988-990

[9] Huntington H B, Grone A R. Current-induced marker motion in gold wire [J]. J. Phys. Chem. Solids, 1961, 20: 76

[10] Lee Y G, Duh J G. Interfacial morphology and concentration profile in the unleaded solder joint assembly [J]. J. Mater. Sci. Mater.Electron., 2000, 11: 33-43

[11] Shi Y W, Lei Y P, Xia Z D, et al. SnAgCu lead-free solders and performance for electronic assembly [J]. Nonferrous Met., 2005, 57(3): 8-15

     (史耀武，雷东平，夏志东等, 电子组装用SnAgCu系无铅钎料合金与性能 [J]. 有色金属，2005, 57(3)：8-15)

[12] Kiani M A, Mousavi M F, Ghasemi S. Inhibitory effect of some amino acids on corrosion of Pb-Ca-Sn alloy in sulfuric acid solution [J]. Corros. Sci., 2008, 20: 1035-1045

[13] Juttner K. Electrochemical impedance spectroscopy (EIS) of corrosion processes on inhomogeneous surfaces [J]. Electrochim. Acta, 1990,35: 1501-1508

[14] Barsoum M W, Hoffman E N, Doherty R D, et al.Driving force and mechanism for spontaneous metal whisker formation [J].Phys. Rev. Lett., 2004, 93(20): DOI: 10. 1103/Phys. Rev. Lett., 93. 206104

[15] Oberndorff P, Dittes M, Crema P, et al. Whisker formation on matte Sn influencing of high humidity [A]. Proc. 55th Electron. Compon. Technol. Conf [C]. USA, Lake Buena Vista, FL, 2005: 429-433

[16] Osenbach J W, DeLucca J M, Potteiger B D, et al. Sn corrosion and its influence on whiskers [J]. IEEE T. Electron. Pack., 2007, 30(1): 23-35

[17] Jiang B, Xian A P，Whisker growth on tin finishes of different electrolytes [J]. Microelectron. Reliabil.，2008，48：105-110

[18] Fan Z G. Research of Electrochemical Corrosion Behaviors of Lead-free Solders [M].Dalian University of Technology, 2008: 17-30

     (樊志罡，无铅钎料的电化学腐蚀行为研究 [M]，大连理工大学硕士论文，2008：17-30)

[19] Tsai Y D, Hu C C, Lin C C. Electrodeposition of Sn-B: lead-free solders: effects of complex agents on the composition, adhesion,and dendrite formation [J]. Electrochim. Acta, 2007, 53: 2040-2047

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