合金元素Sb和Mn对Zn腐蚀的影响

中国腐蚀与防护学报

2008, Vol. 28

Issue (5): 257-264

论文

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合金元素Sb和Mn对Zn腐蚀的影响

李红;张波;王俭秋;韩恩厚;柯伟

中国科学院金属研究所金属腐蚀与防护国家重点实验室

Effect of Sb and Mn alloying additions on the Corrosion Behaviour of Zn

中国科学院金属研究所金属腐蚀与防护国家重点实验室

全文: PDF(1577 KB)

摘要: 采用动电位极化、线性极化、扫描电镜和XPS分析研究了合金元素Sb（含1.0 mass%）和Mn（含0.5 mass% 和1.0 mass%）分别对工业纯Zn（99.95 mass%）在0.1 mol/L NaCl（pH 6）和0.1 mol/L NaCl + 0.1 mol/L Na2SO4 + 0.01 mol/L NaHCO3（pH 8.4）溶液中腐蚀行为的影响。结果表明，Sb主要以Zn-Sb金属间化合物形式存在于Zn中，而Mn除了形成Zn-Mn金属间化合物外，还有一部分固溶在Zn基体中。在0.1 mol/L NaCl溶液中，富Sb相的电化学活性比Zn低且对阴极氧还原反应没有明显的促进作用。富Mn相对阴极氧还原反应有轻微的促进作用，而固溶在Zn基体中的Mn能适当抑制阴极氧还原反应；添加1% Mn和0.5% Mn均对Zn的阳极溶解没有明显影响。在海洋大气环境的模拟溶液（0.1 mol/L NaCl + 0.1 mol/L Na2SO4 + 0.01 mol/L NaHCO3）中，0.5% Mn能显著提高Zn的耐蚀性能，其主要作用机制是少量的Mn能改变产物膜的致密性并影响离子的传输过程。

关键词 ： Zn, 合金元素, 极化曲线, 微观结构, XPS

Abstract：The effects of alloying elements Sb（1 %）and Mn（0.5% and 1%）on the corrosion behaviour of Zn have been studied in 0.1 M NaCl and 0.1 M NaCl + 0.1 M Na2SO4 + 0.01 M NaHCO3 solutions by potentiodynamic polarizations, linear polarization, SEM investigations and XPS analysis. The results indicate that Sb presents only in the Sb-rich intermetallic particles. Compared with Zn matrix, the Sb-rich phases had no significant effect on both cathodic and anodic behaviour of Zn. Mn was found in both the Mn-rich intermetallic particles and the Zn matrix. Electrochemical measurements revealed that Mn in solid solution can reduce the oxygen reduction on Zn and had no significant effect on the anodic behaviour of Zn in 0.1M NaCl solution. In the simulated solution of marine environment (0.1 NaCl + 0.1 Na2SO4 + 0.01 M NaHCO3), 0.5%Mn can significantly increase the corrosion resistance of Zn through the mechanism that it can produce a more compact film and influence ion migration through the pores in the film.

Key words： Zn alloying additions polarization curve microstructure XPS

收稿日期: 2007-09-17

ZTFLH:

TG174.2+2

通讯作者: 张波 E-mail: bxz011@imr.ac.cn

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引用本文:

李红; 张波; 王俭秋; 韩恩厚; 柯伟 . 合金元素Sb和Mn对Zn腐蚀的影响[J]. 中国腐蚀与防护学报, 2008, 28(5): 257-264 .

链接本文:

https://www.jcscp.org/CN/Y2008/V28/I5/257

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