Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

doi:10.11902/1005.4537.2021.138

Journal of Chinese Society for Corrosion and protection

2022, Vol. 42

Issue (4): 540-550 DOI: 10.11902/1005.4537.2021.138

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Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze¹, MENG Lingdong², CAO Xiangkang¹, XIAO Song¹, DONG Zehua¹(

)

^1.School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
^2.School of Materials, Academy of Armored Forces, Beijing 100086, China

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Abstract

The initial atmospheric corrosion behavior of Cu foils induced by co-depositioned with of particulates with different proportions of (NH₄)₂SO₄ and NaCl particles in a weathering chamber was assessed via electrochemical impedance (EIS), quartz crystal microbalance (QCM) and thin foil electrical resistance probe (TER). The results show that the mixed salt particles of (NH₄)₂SO₄ and NaCl promote the initial atmospheric corrosion of PCB-Cu compared with sole NaCl salt particles in the initial 30 h when the total deposition amount is equal. However, after 30 h, the atmospheric corrosion rate of PCB-Cu beneath the mixed salts is significantly lower than that beneath the sole NaCl particles when the mixing ratio of (NH₄)₂SO₄ to NaCl is 1:1, and the inhibition ratio of Cu corrosion can reach 84%, indicating that the (NH₄)₂SO₄ can refrain the corrosion of PCB-Cu beneath induced by NaCl particles. According to the SEM, XRD and XPS analysis of corrosion products, in the early stage of corrosion, due to the catalytic effect of NH4⁺ on the corrosion of Cu, dense Cu₂O corrosion products quickly formed on the copper surface, which dramatically refrains the corrosion of Cu substrate. Although Cu₂O corrosion products are also generated on PCB-Cu surface where NaCl particles are deposited, they are relatively loose and porous, which could accelerate the corrosion of Cu beneath porous Cu₂O layer due to the cathodic depolarization of the corrosion product layer.

Key words: atmospheric corrosion PCB copper pollutant corrosion monitoring electrical resistance probe quartz crystal microbalance

Received: 15 June 2021

ZTFLH:

TG174

Fund: National Natural Science Foundation of China(51371087)

Corresponding Authors: DONG Zehua E-mail: zhdong@hust.edu.cn

About author: DONG Zehua, E-mail: zhdong@hust.edu.cn

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Cite this article:

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua. Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board. Journal of Chinese Society for Corrosion and protection, 2022, 42(4): 540-550.

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https://www.jcscp.org/EN/10.11902/1005.4537.2021.138 OR https://www.jcscp.org/EN/Y2022/V42/I4/540

Fig.1 EIS plots of comb-like electrodes with surface deposition of different proportions of mixed salts after exposure for 72 h at 30 ℃ and RH80%

Fig.2 Schematic diagram of absorbed thin electrolyte layer on the symmetric comb-like electrode (a) and the corresponding equivalent circuit for EIS curve fitting (b)

Table 1 Fitting results of EIS of comb-like Cu electrodes with surface deposition of different proportions of mixed salt particles after exposure at 30 ℃ and RH80% for 72 h

Fig.3 Bode plots of the comb-like Cu electrodes with surface deposition of 40 µg/cm² ammonium sulfate (a) and sodium sulfate (b) after exposure for 2 h at 30 ℃ under different humidity conditions

Fig.4 EIS of the comb-like Cu electrodes with surface deposition of different proportions of mixed salt particles after exposure in the weathering chamber at 30 ℃ and RH90% for 72 h

Table 2 Fitting results of comb-like Cu electrode after surface deposition with different proportions of mixed salt particles at 30 ℃ and RH90% for 72 h

Fig.5 Time dependences of low-frequency impedance |Z|_{0.01 Hz} of the comb-like electrodes with surface deposition of different proportions of salt particles during exposure at 30 ℃ and RH90%

Fig.6 Comparison of |Z|_{0.01 Hz} of the comb-like electrodes with surface deposition of different proportions of sodium sulfate, ammonium sulfate and sodium chloride salt particles after exposure at 30 ℃ and RH90%

Fig.7 Mass gains of Cu-plated quartz crystal with surface deposition of different proportion of salt particles during exposure at 30 ℃ and RH90%

Fig.8 Variations of thickness loss (a, c) and corrosion rate (b) of thin Cu electrical resistance probe with corrosion time and proportion of deposited salt particles during exposure at 30 ℃ and RH90%

Fig.9 XRD patterns of corrosion products formed on Cu specimen deposited with different proportions of salt particles after exposure at 30℃ and RH90% for 72 h

Fig.10 XPS spectra of Cu 2P, S 2P, C 1s of Cu specimen deposited with 40 µg/cm² NaCl, mixture of NaCl and (NH₄)₂SO₄ (1:1) and (NH₄)₂SO₄ after exposure at 30 ℃ and RH90% for 3 d

Fig.11 Corrosion morphologies of copper specimens deposited with the mass ratio of NaCl 0:0 (a), 4:0 (b), 3:1 (c), 2:2 (d), 1:3 (e) and 0:4 (f) of salt particles after exposure at 30 ℃ and RH90% for 3 d

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