Synergistic Effect of Triethyl Phosphate and Cerium (IV) Ion on Corrosion Inhibition for Copper in Hydrochloric Acid Solution

doi:10.11902/1005.4537.2013.152

Journal of Chinese Society for Corrosion and protection

2014, Vol. 34

Issue (3): 271-276 DOI: 10.11902/1005.4537.2013.152

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Synergistic Effect of Triethyl Phosphate and Cerium (IV) Ion on Corrosion Inhibition for Copper in Hydrochloric Acid Solution

ZENG Huijing¹, LI Guangyong², WU Huan¹, GAO Lixin¹, ZHANG Daquan¹(

)

1. School of Environmental and Chemical Engineering, Shanghai University of Electric Power, Shanghai 200090, China
2. Department of Pharmaceutical Engineering, Henan College of Medical Technician, Kaifeng 475004, China

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Abstract

The inhibition effect of triethyl phosphate (TEP) and the synergistic effect of TEP and rare earth Ce⁴⁺ on the corrosion of copper in 0.5 mol/L hydrochloric acid solution were studied by electrochemical impedance spectra and potentiodynamic polarization curve. The result reveals that the inhibition efficiency of the mixed inhibitor increases with the increase of the concentration of Ce⁴⁺ until the critical concentration is reached when TEP concentration remains unchanged. When Ce⁴⁺ concentration remains unchanged, the inhibition efficiency increased with the increase of the concentration of TEP, reaching 80.6% at 1 mmol/L Ce⁴⁺ and 58.7 mmol/L TEP.

Key words: triethyl phosphate Ce⁴⁺ copper corrosion inhibition synergism

Received: 31 July 2013

ZTFLH:

TG174.42

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	Huijing ZENG
	Guangyong LI
	Huan WU
	Lixin GAO
	Daquan ZHANG

Cite this article:

ZENG Huijing, LI Guangyong, WU Huan, GAO Lixin, ZHANG Daquan. Synergistic Effect of Triethyl Phosphate and Cerium (IV) Ion on Corrosion Inhibition for Copper in Hydrochloric Acid Solution. Journal of Chinese Society for Corrosion and protection, 2014, 34(3): 271-276.

URL:

https://www.jcscp.org/EN/10.11902/1005.4537.2013.152 OR https://www.jcscp.org/EN/Y2014/V34/I3/271

Fig.1

Cu电极在含不同浓度TEP的0.5 mol/L盐酸溶液中浸泡1 h后的Nyquist图

Fig.2

电化学阻抗谱的等效模拟电路图

Table 1 Impedance parameters for copper electrode immersed in 0.5 mol/L HCl solution for 1 h

Fig.3

Cu电极在含不同浓度TEP与不同浓度Ce⁴⁺复配缓蚀剂的0.5 mol/L盐酸溶液中浸泡1 h后的Nyquist图

Fig.4

Cu电极在含TEP/Ce⁴⁺复配缓蚀剂的0.5 mol/L盐酸溶液中浸泡1 h后的Nyquist图

Table 2 Impedance parameters for copper electrode immersed in 0.5 mol/L HCl solution containing different inhibitors for 1 h

Fig.5

Cu在含TEP的0.5 mol/L盐酸溶液中浸泡1 h后的极化曲线

Fig.6

Cu在含TEP/Ce⁴⁺的0.5 mol/L盐酸溶液中浸泡1 h后的极化曲线

Table 3 Electrochemical polarization parameters for copper electrode immersed for 1 h in 0.5 mol/L HCl solutions containing various concentrations of TEP

Table 4 Electrochemical polarization parameters for copper electrode immersed for 1 h in 0.5 mol/L HCl solutions containing 1.0 mmol/L Ce⁴⁺ and various concentrations of TEP

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