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Preparation of High-tin Bronze Corrosion-resistant Coating by Potentiostatic Pulse Electrodeposition |
BAO Ren1, ZHOU Genshu1( ), LI Hongwei2 |
1. State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China 2. Equipment Maintenance Center, Shenhua Shenmu Coal Group Company, Shenmu 719315, China |
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Abstract Aiming at the proposed potentiostatic pulse electrodeposition of Cu-Sn alloy, the influence of process parameters on the composition, grain size and corrosion resistance of prepared coatings is studied. The morphology, grain size, chemical composition and corrosion behavior of the Cu-Sn coatings electrodeposited by potentiostatic pulse technology or constant-current pulse technology are characterized by means of scanning electron microscope (SEM) with energy dispersive spectroscopy (EDS) and electrochemical workstation. It is found that potentiostatic pulse process of Cu-Sn electroplating with the duty ratio of 33% and potential of 3 V could reduce the dissolution probability of the plating layer and maintained the complex ion migration and deposition driving force, so that the high-tin bronze coating can be obtained on parts of different size. The grain size of the coating on the part with surface area 78.5 mm2 is less than 100 nm. Under the same initial conditions, the electrodeposition rate of the potentiostatic pulse technology is faster than that of the constant current pulse technology, besides the plated alloy presents much better composition uniformity and the formed coating possesses only few of pores and crystallite clusters, therefore the coating exhibits corrosion resistance 2 times higher than that made by constant-current pulse. Compared with the constant current pulse technology, the potentiostatic pulse electrodeposition is beneficial to improve the quality and corrosion resistance of copper-tin plating and which may facilitate the introduction of processing automation or composition control for complex parts as well.
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Received: 20 June 2019
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Fund: Science and Technology Innovation Program of Xi'an(201805064ZD15CG48) |
Corresponding Authors:
ZHOU Genshu
E-mail: zhougs@xjtu.edu.cn
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