PREPARATION AND CORROSION RESISTANCE OF COPPER MULTILAYER COATING OBTAINED BY ULTRASONIC-ELECTRODEPOSITION

J Chin Soc Corr Pro

2011, Vol. 31

Issue (2): 145-148 DOI:

Research Articles

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PREPARATION AND CORROSION RESISTANCE OF COPPER MULTILAYER COATING OBTAINED BY ULTRASONIC-ELECTRODEPOSITION

CUI Ronghong^1,2, YU Zhiming², HE Yuting¹, SHU Wenjun¹, DU Jinqiang¹, NIU Yunsong²

1. Engineering College, Air Force Engineering University, Xi'an 710038
2. State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016

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Abstract Copper multilayer coating was obtained by ultrasonic-electrodeposition method. SEM, XRD technology, mass loss measurement and anodic polarization curves were employed to study its metallurgical structure and corrosion resistance performance. The results show that the layer thickness of it is about 0.3 μm, and the microstructure of it is much more compact. The XRD analysis results show that its texture coefficients of (200) and (111) are obviously improved, while the (220) texture coefficient is much weaker. The average bubbling time of it in 20% HNO₃ solution is about 380 s, nearly three times longer than that (148 s) of the ordinary electrodeposited copper coating sample, and the corrosion rate is obviously decreased, Anode polarization curves in 3.5% NaCl solution show that the corrosion potential of it is higher, and the corrosion current of it is less than 1/5 of that of ordinary electrodeposited copper coating, which means the corrosion resistance is greatly improved.

Key words: ultrasonic-electrodeposition copper multilayer coating corrosion resistance

Received: 05 March 2010

ZTFLH:

TQ153.1

Corresponding Authors: HE Yuting E-mail: hyt666@tom.com

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Cite this article:

CUI Ronghong, YU Zhiming, HE Yuting, SHU Wenjun, DU Jinqiang, NIU Yunsong. PREPARATION AND CORROSION RESISTANCE OF COPPER MULTILAYER COATING OBTAINED BY ULTRASONIC-ELECTRODEPOSITION. J Chin Soc Corr Pro, 2011, 31(2): 145-148.

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https://www.jcscp.org/EN/ OR https://www.jcscp.org/EN/Y2011/V31/I2/145

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