Cu has excellent electrical conductivity and corrosion resistance and is one of the ideal materials for grounding electrodes. Herein, the corrosion behavior of Cu was assessed in artificial solutions, simulating the leaching solution of the soil at Korla district of Xinjiang with different Cl^- content namely 0.05%, 0.5%, 1.0%, and 2.0% in mass fraction, was studied via immersion test for 28 d and electrochemical measurement etc. The surface morphology, corrosion products, and corrosion rate of Cu were then characterized after the immersion test. The results show that in solutions with low chloride-content (≤ 0.5%), the Cu surface exhibits relatively mild corrosion degree with slight corrosion products and relatively small amount of corrosion pits, which corresponds to better corrosion resistance. Contrast, in solutions with high Cl^--content (≥ 1.0%), the surface corrosion of Cu is relatively severe with significant corrosion products and much more corrosion pits. Taking the corrosion rates of Cu in solutions with different Cl^--content, the corrosiveness of solutions may be ranked as the following order: 2.0% > 1.0% > 0.5% > 0.05%. In terms of corrosion products, for the solutions with 0.05%, 0.5% and 1.0%Cl^-, the formed corrosion products compose mainly of Cu₂O and CuO; While for the solution with 2.0%Cl^-, the corrosion products compose mainly of Cu₂O, CuO, and Cu₂(OH)₂CO₃. As the Cl^--content increases, the corrosion rate rises and more corrosion products form. When the Cl^--content reaches 2.0%, the Cu may immerse in a strongly corrosive medium for a long time and react with CO₂ in the solution, thus gradually generate a less protective greenish basic copper carbonate on the Cu surface, by which the corrosion may be intensified. Electrochemical analysis also indicates that, as the Cl^--content increases, the capacitive arc radius as well as R_ct (Charge transfer resistance) decreases, the corrosion current density increases, therewith the Cu corrosion becomes more severe.