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| The effect of the sulfate reducing bacteria biofilm on phase boundary between HSn70-1AB copper alloy and solution |
| 北京交通大学市政环境工程系 |
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Abstract Growth characteristics of Sulfate Reducing Bacteria (SRB) was tested. The SRB was in logarithmic-phase growth during the first three days and turn into stationary-phase growth since then. Atomic Force Microscopy (AFM) and Electrochemical Impedance Spectroscopy, respectively (EIS) have been used to investigate the effect of biofilm on phase boundary of HSn70-1 AB copper alloy and solution. The study using AFM showed that SRB cells adhered to the surface of copper alloy and the biofilm formed during three days immergence were observed. Roughness of three-day-old biofilm formed on the alloys was 44.7nm, while roughness of the biofilm decreased to 25.8nm after 14 days immergence. The simulative date of EIS spectrum revealed that transfer resistance (Re) of the electric double layer on the alloy surface increases with the immergence prolonged. Furthermore, capacitance value (Yp) of oxidation film on the alloy surface changed seriously, which indicated the structure of oxidation film was impacted.
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Received: 04 January 2007
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