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采用丝束电极技术研究液滴下Cu腐蚀行为 |
张彭辉1, 王燕华1( ), 彭欣2, 刘在健1, 周媛媛1, 王佳1,3 |
1. 中国海洋大学化学化工学院 海洋化学理论与工程技术教育部重点实验室 青岛 266100 2. 浙江大学 舟山海洋研究中心 舟山 316000 3. 中国科学院金属研究所 金属腐蚀与防护国家重点实验室 沈阳 110016 |
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Study of Corrosion Behavior of Copper Beneath a Droplet by Means of Wire Beam Electrode Technology |
ZHANG Penghui1, WANG Yanhua1( ), PENG Xin2, LIU Zaijian1, ZHOU Yuanyuan1, WANG Jia1,3 |
1. Key Laboratory of Marine Chemistry Theory and Technology, Ministry of Education, College of Chemistry and Chemical Engineering, Ocean University of China, Qingdao 266100, China 2. Ocean Research Center of Zhoushan, Zhejiang University, Zhoushan 316000, China 3. State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China |
引用本文:
张彭辉, 王燕华, 彭欣, 刘在健, 周媛媛, 王佳. 采用丝束电极技术研究液滴下Cu腐蚀行为[J]. 中国腐蚀与防护学报, 2014, 34(5): 459-464.
Penghui ZHANG,
Yanhua WANG,
Xin PENG,
Zaijian LIU,
Yuanyuan ZHOU,
Jia WANG.
Study of Corrosion Behavior of Copper Beneath a Droplet by Means of Wire Beam Electrode Technology. Journal of Chinese Society for Corrosion and protection, 2014, 34(5): 459-464.
链接本文:
https://www.jcscp.org/CN/10.11902/1005.4537.2013.197
或
https://www.jcscp.org/CN/Y2014/V34/I5/459
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