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| Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment |
LIU Yuanhai1, LI Yuzhu2, YU Dazhao3, MU Xianlian1, LIU Jie2( ) |
1 China Special Vehicle Reserch Institute, Key Laboratory of Corrosion Protection and Control of Aviation Technology, Jingmen 448035, China
2 School of Chemistry and Chemical Engineering, Yantai University, Yantai 264005, China
3 School of Basic Sciences for Aviation, Naval Aviation University, Yantai 264000, China |
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Cite this article:
LIU Yuanhai, LI Yuzhu, YU Dazhao, MU Xianlian, LIU Jie. Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment. Journal of Chinese Society for Corrosion and protection, 2024, 44(5): 1145-1156.
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Abstract Printed circuit board (PCB) was one of the indispensable basic components in the electronic system, once damaged will lead to the failure of the entire electronic system. Therefore, it was particularly important to understand the nature of corrosion failure of PCB in practical service. This paper summarized the main factors that lead to the corrosion failure of PCB, including the property factors related with materials and external environmental factors (temperature, relative humidity, corrosive gas, electric field, etc.), summarizing the advantages and disadvantages of different surface treatment processes, and concluding the synergistic effect of external environment factors on the corrosion failure mechanism of PCB. The main testing methods for corrosion failure research of PCB is summarized. The advantages and disadvantages of different testing methods in corrosion failure research of PCB were clarified, and the progress of common corrosion types of PCB in different service environments was summarized. Finally, the combination of environmental testing and simulation analysis was proposed to establish a PCB corrosion model that was more suitable for the actual service environment.
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Received: 27 November 2023
32134.14.1005.4537.2023.377
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| Fund: Taishan Scholar Project of Shandong Province(tsqn202306160);Science Fund of Shandong Laboratory of Advance Materials and Green Manufacturing at Yantai(AMGM2024F03) |
Corresponding Authors:
LIU Jie, E-mail: liujie6573@163.com
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