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Effect of Cu-/Ag-activation on Growth and Corrosion Resistance of Electroless Plated Ni-film on Plasma Electrolytic Oxidation Coating |
TIAN Weiping1, GUO Liangshuai2,3, WANG Yuhang3, ZHOU Peng3, ZHANG Tao3() |
1.Qingan Group Co. Ltd., Xi'an 710077, China 2.Tianjin Aerospace Long March Rocket Manufacturing Co. Ltd., Tianjin 300462, China 3.Shenyang National Laboratory for Materials Science, Northeastern University, Shenyang 110819, China |
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Abstract The plasma electrolytic oxidation (PEO) coating is a ceramic-like coating without catalytic activity of its surface, thus which should be activated with noble metal Pd before an electroless nickel (EN) plating process can be conducted. To replace the expensive Pd-activation process, Cu-activation and Ag-activation methods were developed. A field emission-scanning electron microscopy was employed to characterize the surface morphology and cross-section morphology of EN films on the Cu- and Ag-activated PEO coatings. In comparison with the Cu-activated PEO coating, a thicker, compact and more uniform EN layer film was formed on the Ag-activated PEO coating. Moreover, the results of electrochemical tests shown that the EN film plated on Ag-activated coating presents more or less the same corrosion resistance as the EN film plated on Pd-activated PEO coating, and better than the EN film plated on Cu-activated PEO coating. Hence, the Ag-activation method significantly reduce the cost, and best of all, it guaranteed the corrosion resistance of the composite coating.
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Received: 29 June 2021
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Fund: National Natural Science Foundation of China(51771050);National Natural Science Foundation of China(51531007);Liaoning Revitalization Talents Program(XLYC2002071) |
Corresponding Authors:
ZHANG Tao
E-mail: zhangtao@mail.neu.edu.cn
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About author: ZHANG Tao, E-mail: zhangtao@mail.neu.edu.cn
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