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CONTROL FACTORS OF TIME OF WETNESS AND IRP CORROSION RATE FOR Q235 STEEL UNDER PURE WATER THIN FILM |
TANG Zilong; SONG Xin; ZHANG Yipin |
School of Materials Science and Engineering; Tianjin University; Tianjin 300072 |
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Abstract With a series of factors such as time of immersion (TOI), temperature (Temp) and relative humidity (RH), the time of wetness (TOW) of Q235 steel covered by pure water thin film is investigated. The effect of the three factors on corrosion rate is also studied by Inductive Resistance Probe (IRP) measurement and Integration Filter Algorithm (IFA) previously implemented by the author. Standardization protocol (data mining technique) for multivariate analysis of variance is introduced in order to improve the accuracy of TOW linear regression model. The results prove the successful adoption of standardization protocol. Temperature plays a more important role than the humidity in shortening TOW for clean samples at elevated temperature. Around 20 ℃, a significant change of temperature effect on TOW is observed. IRP measurement plus IFA corrosion rate calculation confirms the judgment on temperature effect. Corrosion rate could be clustered into two groups( high and low zone) around the thresholds of 20 ℃ and RH 80% based on cluster analysis on corrosion rate. Quantitative evaluation on corrosion rate between high and low corrosion rate zones shows 4 times difference. Plateau in the very early stage of PLU movement over time of low corrosion rate zone is recorded at first time. However, no PLU plateau is observed for system at higher temperature than 20 ℃ and/or higher RH than 80%. A primary reasoning about this PLU plateau is assumed to be bounded with corrosion rate which is the function of temperature and humidity. This interesting and impressive PLU plateau could indicate the possible composition and/or structure transformation of corrosion product layer under thin liquid film and deserves more effort in future work.
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Received: 19 November 2007
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Corresponding Authors:
Zilong TANG
E-mail: zlt633@tju.edu.cn
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