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印制电路板在服役环境中的腐蚀失效行为研究进展 |
刘元海1, 李玉珠2, 郁大照3, 慕仙莲1, 刘杰2( ) |
1 中国特种飞行器研究所 结构腐蚀防护与控制航空科技重点实验室 荆门 448035 2 烟台大学化学化工学院 烟台 264005 3 海军航空大学航空基础学院 烟台 264000 |
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Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment |
LIU Yuanhai1, LI Yuzhu2, YU Dazhao3, MU Xianlian1, LIU Jie2( ) |
1 China Special Vehicle Reserch Institute, Key Laboratory of Corrosion Protection and Control of Aviation Technology, Jingmen 448035, China 2 School of Chemistry and Chemical Engineering, Yantai University, Yantai 264005, China 3 School of Basic Sciences for Aviation, Naval Aviation University, Yantai 264000, China |
引用本文:
刘元海, 李玉珠, 郁大照, 慕仙莲, 刘杰. 印制电路板在服役环境中的腐蚀失效行为研究进展[J]. 中国腐蚀与防护学报, 2024, 44(5): 1145-1156.
Yuanhai LIU,
Yuzhu LI,
Dazhao YU,
Xianlian MU,
Jie LIU.
Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment[J]. Journal of Chinese Society for Corrosion and protection, 2024, 44(5): 1145-1156.
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陈星慈. 电路板爬行腐蚀对云算及电子产品的挑战与威胁 [J]. 电子工艺技术, 2013, 34(2): 86
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