|
|
Corrosion Behavior of Cu-15Ni-8Sn Alloy in 3.5%NaCl Solution Containing S2- |
FAN Shilin1,2, DU Juan2( ), YANG Shaodan3, ZHOU Yanjun4, SONG Kexing2, ZHANG Guoshang2, YUE Pengfei2, YANG Ran4, WANG Xiaojun1 |
1 Zhengzhou Research Institute of Harbin Institute of Technology, Zhengzhou 450046, China 2 Institute of Materials Science, Henan Academy of Sciences, Zhengzhou 450046, China 3 School of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450046, China 4 School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China |
|
Cite this article:
FAN Shilin, DU Juan, YANG Shaodan, ZHOU Yanjun, SONG Kexing, ZHANG Guoshang, YUE Pengfei, YANG Ran, WANG Xiaojun. Corrosion Behavior of Cu-15Ni-8Sn Alloy in 3.5%NaCl Solution Containing S2-. Journal of Chinese Society for Corrosion and protection, 2025, 45(5): 1408-1416.
|
Abstract The corrosion behavior of Cu-15Ni-8Sn alloy in 3.5%NaCl solution containing 10 mg/L sulfur ions (S2-) was assessed by means of immersion tests, electrochemical impedance spectroscopy (EIS), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray photoelectron spectroscopy (XPS). The results show that after 30 d of immersion in 3.5%NaCl solution without sulfur ions, a stable passivation film is formed on the surface of Cu-15Ni-8Sn alloy, mainly composed of basic copper chloride Cu2(OH)3Cl. The passivation film can effectively prevent the further attack of Cl-, and the average corrosion rate is 0.02235 g·m-2·h-1. In sulfur ion-containing solutions, the sulfides (Cu2S and CuS) formed in the initial stage provide a certain degree of protection. However, with the extension of time, after the alloy is immersed and corroded for 30 days in the solution containing sulfur ions, the corrosion weight loss rate is 0.03418 g·m-2·h-1, which is higher than that in the solution without sulfur ions. the corrosion products are turn into the mixture of basic copper chloride (Cu2(OH)3Cl), copper sulfate (CuSO4), copper sulfide (CuS), nickel hydroxide (Ni(OH)2), and tin sulfide (SnS2). This porous corrosion film provides much weaker protection for the alloys, and the deterioration and rupture of the sulfide film further aggravate the corrosion process, making the average corrosion rate of the alloy in the sulfur ion-containing environment higher than that in a sulfur ion-free environment.
|
Received: 31 October 2024
32134.14.1005.4537.2024.355
|
|
Fund: Research Start-up Funding of Henan Academy of Sciences(231817003);Henan Provincial Natural Science Foundation(242300420030) |
Corresponding Authors:
DU Juan, E-mail: juan_du@hnas.ac.cn
|
[1] |
Caris J, Varadarajan R, Stephens Jr J J, et al. Microstructural effects on tension and fatigue behavior of Cu-15Ni-8Sn sheet [J]. Mater. Sci. Eng., 2008, 491A: 137
|
[2] |
Lei Y H, Yin Y S, Liu C H, et al. Electrochemical corrosion behavior of Cu-15Ni-8Sn alloy in marine microbial medium [J]. Adv. Mater. Res, 2009, 79-82: 1099
|
[3] |
Appa Rao B V. Chaitanya Kumar K. 5-(3-Aminophenyl)tetrazole-A new corrosion inhibitor for Cu-Ni (90/10) alloy in seawater and sulphide containing seawater [J]. Arab. J. Chem., 2017, 10(suppl. 2) : S2245
|
[4] |
Patil A P, Tupkary R H. Cu-Ni-Zn-Mn alloys for sulphide polluted seawater applications [J]. J. Corros. Sci. Eng., 2003, 7
|
[5] |
Yuan T, Zhang M D, Ni J H, et al. The brazing effect on the corrosion mechanism of a multilayer material with Cu [J]. Anti-Corros Methods Mater., 2017, 64: 664
|
[6] |
ElDomiaty A, Alhajji J N. The susceptibility of 90Cu-10Ni alloy to stress corrosion cracking in seawater polluted by sulfide ions [J]. J. Mater. Eng. Perform., 1997, 6: 534
|
[7] |
Alhajji J N, Reda M R. Corrosion of Cu-Ni alloys in sulfide-polluted seawater [J]. Corrosion, 1993, 49: 809
|
[8] |
Eiselstein L E, Syrett B C, Wing S S, et al. The accelerated corrosion of Cu-Ni alloys in sulphide-polluted seawater: mechanism no.2 [J]. Corros. Sci., 1983, 23: 223
|
[9] |
De Sanchez S R, Schiffrin D J. The flow corrosion mechanism of copper base alloys in sea water in the presence of sulphide contamination [J]. Corros. Sci., 1982, 22: 585
|
[10] |
Shi Z Y, Liu B, Liu Y, et al. Progress of corrosion behavior and anti-corrosion technology for typical copper-nickel alloys under marine environment [J]. Equip. Environ. Eng., 2020, 17(8): 38
|
|
石泽耀, 刘 斌, 刘 岩 等. 典型铜镍合金在海洋环境中腐蚀行为与防护技术研究进展 [J]. 装备环境工程, 2020, 17(8): 38
|
[11] |
Deyong L, Elboujdaïni M, Tremblay R, et al. Electrochemical behaviour of rapidly solidified and conventionally cast Cu-Ni-Sn alloys [J]. J. Appl. Electrochem., 1990, 20: 756
|
[12] |
Amegroud H, Guenbour A, Bellaouchou A, et al. A comprehensive investigation of the electrochemical behavior of nickel-aluminum bronze alloy in alkaline solution: the effect of film formation potential [J]. Colloids Surf., 2021, 614A: 126126
|
[13] |
Kuss C, Payne N A, Mauzeroll J. Probing passivating porous films by scanning electrochemical microscopy [J]. J. Electrochem. Soc., 2016, 163: H3066
|
[14] |
Pan W, Li Y, Sun Z Y, et al. Application of electrochemical impedance spectroscopy in corrosion protection [J]. New Chem. Mater., 2021, 49(10): 257
|
|
潘 巍, 李 瑜, 孙昭宜 等. 电化学阻抗谱技术在腐蚀防护中的应用现状 [J]. 化工新型材料, 2021, 49(10): 257
|
[15] |
Wang L Q, Snihirova D, Deng M, et al. Revealing physical interpretation of time constants in electrochemical impedance spectra of Mg via Tribo-EIS measurements [J]. Electrochim. Acta, 2022, 404: 139582
|
[16] |
Zhao J G, Gong X X, Yu Y P, et al. Research and application of Cu-15Ni-8Sn elastic alloy [J]. Shanghai Met. (Col. Sec.), 1989, (3): 15
|
|
赵建国, 龚学湘, 俞玉平 等. Cu-15Ni-8Sn弹性合金的研究与应用 [J]. 上海金属有色分册, 1989, (3): 15
|
[17] |
Wang S L, Li J L, Zhang R X, et al. Charge transfer resistance of copper and nickel thin film electrodes in nano dimensions [J]. Mater. Lett., 2017, 198: 61
|
[18] |
Li G X, Xing H Y, Du M, et al. Accelerated corrosion of 70/30 copper-nickel alloys in sulfide-polluted seawater environment by sulfide [J]. J. Mater. Res. Technol., 2024, 30: 8620
|
[19] |
Wang B N, Wang X Z, Yang S, et al. Research progress on catalysts for organic sulfur hydrolysis: Review of activity and stability [J]. Chin. J. Chem. Eng., 2024, 71: 203
|
[20] |
Liu T, Zhang W X, Zhai X Y, et al. Dense ternary-size particles interstitial filling gradation stacking model for preparing high-quality indium tin oxide targets [J]. Chem. Eng. Sci., 2022, 248: 117165
|
[21] |
Nesbitt H W, Legrand D, Bancroft G M. Interpretation of Ni 2p XPS spectra of Ni conductors and Ni insulators [J]. Phys. Chem. Min., 2000, 27: 357
|
[22] |
Ulrich Hillebrecht F, Fuggle J C, Bennett P A, et al. Electronic structure of Ni and Pd alloys. II. X-ray photoelectron core-level spectra [J]. Phys. Rev., 1983, 27B: 2179
|
[23] |
Dahal S, Rana D, Sinkovic B. Changes in electronic structure within NiS x (0.60 < x < 1.53) compound series [J]. Vacuum, 2025, 231: 113806
|
[24] |
Koteeswara Reddy N, Devika M, Hahn Y B, et al. Impact of chemical treatment on the surface, structure, optical and electrical properties of SnS thin films [J]. Appl. Surf. Sci., 2013, 268: 317
|
[25] |
Yin B, Liu T, Dong L H, et al. Corrosion resistance of Cu-15Ni-8Sn alloy in seawater [J]. Corros. Prot., 2012, 33: 849
|
|
尹 兵, 刘 涛, 董丽华 等. Cu-15Ni-8Sn合金在海水中的耐腐蚀性研究 [J]. 腐蚀与防护, 2012, 33: 849
|
[26] |
Mansfeld F, Liu G, Xiao H, et al. The corrosion behavior of copper alloys, stainless steels and titanium in seawater [J]. Corros. Sci., 1994, 36: 2063
|
[27] |
Li G X, Xing H Y, Du M, et al. Accelerated corrosion of 70/30 copper-nickel alloys in sulfide-polluted seawater environment by sulfide [J]. J. Mater. Res. Technol., 2024, 30: 8620
|
[28] |
Al Hossani H I, Saber T M H, Mohammed R A, et al. Galvanic corrosion of copper-base alloys in contact with molybdenum-containing stainless steels in Arabian gulf water [J]. Desalination, 1997, 109: 25
|
No Suggested Reading articles found! |
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|