Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature

doi:10.11902/1005.4537.2022.244

Journal of Chinese Society for Corrosion and protection

2023, Vol. 43

Issue (3): 544-552 DOI: 10.11902/1005.4537.2022.244

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Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature

ZHU Hao¹, CHENG Yi¹, SONG Xuan¹, ZHAO Wenxia¹(

), LI Xinwei¹, LIU Xin¹, HUI Kaihong¹, CHEN Huaijun¹, ZHAI Shilong²

^1.School of Chemistry and Chemical Engineering, Ningxia Normal University, Guyuan 756000, China
^2.School of Physical Science and Technology, Northwestern Polytechnical University, Xi'an 710129, China

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Abstract

In general, certain additives were incorporated into potassium sodium tartrae based electrolyte for electroless copper plating, aiming to improve its stability and the electroless copper plating efficiency. Herewith, L-malic acid and 2,2'-bidipyridine were selected as additives. The effect of L-malic acid and 2,2'-bidipyridine individually or in combination as additives on the performance of the sodium potassium tartrate based electrolyte for copper plating on polyacrylonitrile-butadiene-styrene copolymer (ABS) plates was studied, while the ABS has been subjected to light etching pre-treatment in an optimized MnO₂-H₂SO₄-H₂O ternary solution. The results showed that the addition of L-malic acid increased the Cu-deposition rate, while the addition of 2,2'-bidipyridine decreased the Cu-deposition rate. When the combination additives of 2 mg/LL-malic acid and 1 mg/L2,2'-bidipyridine were added to the potassium sodium tartrate electroless copper plating system, the deposition rate increased from 3.94 µm/h to 5.20 µm/h, and the copper plating system has higher stability. Accordingly, the acquired Cu-coating was uniform, compact and good adhesive to the substrate, and which presents light pink color with a high gloss as well. Finally, a stable low temperature electroless copper plating system was determined in terms of the bath stability, Cu-deposition rate, and the coating morphology and gloss etc.

Key words: sodium potassium tartrate electroless copper plating L-malic acid 2,2'-bidipyridine deposition rate

Received: 28 July 2022 32134.14.1005.4537.2022.244

ZTFLH:

TQ153.1

Fund: National Natural Science Foundation of China(21561027);First-class Discipline in Ningxia Colleges and Universities pedagogy(NXYLXK2017B11);Natural Science Foundation of Ningxia(2020AAC03266);Natural Science Foundation of Ningxia(2022AAC03298);Science and Technology Innovation Leading Talent Project of Ningxia Hui Autonomous Region(KJT2016004);Ningxia Youth Top-notch Talent([2017]787);Ningxia New University Think Tank Project([2018]12);Science and Technology Project of Guyuan City(2020-GYKYF003);Liupanshan Resource Engineering and Technology Research Center(HGZD22-18);Key Discipline of Inorganic Chemistry([2017]83)

Corresponding Authors: ZHAO Wenxia, E-mail: zwxchj2006@163.com

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	ZHU Hao
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	SONG Xuan
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	LI Xinwei
	LIU Xin
	HUI Kaihong
	CHEN Huaijun
	ZHAI Shilong

Cite this article:

ZHU Hao, CHENG Yi, SONG Xuan, ZHAO Wenxia, LI Xinwei, LIU Xin, HUI Kaihong, CHEN Huaijun, ZHAI Shilong. Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature. Journal of Chinese Society for Corrosion and protection, 2023, 43(3): 544-552.

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https://www.jcscp.org/EN/10.11902/1005.4537.2022.244 OR https://www.jcscp.org/EN/Y2023/V43/I3/544

Fig.1 SEM images of ABS substrates after etching for 10 min (a), 15 min (b), 20 min (c) and 25 min (d)

Fig.2 Contact angle of ABS as a function of etching time

Fig.3 Adhesion strength of the electroless copper on ABS substrate as a function of etching time

Fig.4 Deposition rate of electroless plating copper as a function of the addition concentration of L-malic acid in the plating bath

Fig.5 Variation of the deposition rate of electroless plating copper with the addition concentration of 2,2'-bidipyridine in the plating bath

Table 1 Orthogonal test results of the effect of L-malic acid and 2,2 '- bipyridine on deposition rate

Table 2 Range analysis of the effect of L-malic acid and 2,2 '- bipyridine on the deposition rate

Fig.6 Variations of the deposition rate of electroless plating copper with the addition concentration of both L-malic acid and 2,2'-bidipyridine

Fig.7 Surface photos of electroless plating copper under the conditions of adding different agents: (a) without additional reagent, (b) 2 mg/L L- malic acid, (c) 1 mg/L 2,2'-bidipyridine, (d) 2 mg/L L- malic acid and 1 mg/L 2,2'-bidipyridine

Fig.8 SEM surface morphologies of electroless plating copper films under the conditions of adding different agents: (a) without additional reagent, (b) 2 mg/L L- malic acid, (c) 1 mg/L 2,2'-bidipyridine, (d) 2 mg/L^{L- malic acid and 1 mg/L^{2,2'-bidipyridine}}

Fig.9 Effects of the addition of both L-malic acid and 2,2'-bidipyridine on the anodic and cathodic polarization curves

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