INFLUENCES OF ADDITIVES ON ELECTROLESS THICK COPPER PLATING BASED ON THPED SYSTEM

J Chin Soc Corr Pro

2011, Vol. 31

Issue (5): 362-366 DOI:

Research Articles

Current Issue | Archive | Adv Search

INFLUENCES OF ADDITIVES ON ELECTROLESS THICK COPPER PLATING BASED ON THPED SYSTEM

SHEN Xiaoni^1,2, ZHAO Dongmei¹, REN Fengzhang¹, TIAN Baohong¹

1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003
2. Henan Key Laboratory of Advanced Nonferrous Metal Materials,Luoyang 471003

Download:

PDF(1006KB)
Export: BibTeX | EndNote (RIS)

Abstract The influences of additives on plating rate, coating quality and bath stability were investigated to develop THPED-EDTA•2Na thick copper plating process. The plating rate is obviously increased by proper amount of L-arginine, and its proper dosage is 0.15 mg•L^-1; the coating quality is greatly improved by proper amount of PEG and ferrous potassium cyanide in spite of slight decrease of plating rate, and the proper amount are 150 mg•L^-1and 20 mg•L^-1, respectively. The stability of bath is enhanced by all these additives and the stability time of bath in which mixed additives is added reaches the highest of 5 h at 80℃. The plating rate is 7.10 μm•h^-1 and the backlight level achieves 10th grade under appropriate conditions after plating for 15 min. The coating is red, bright and uniform, the sedimentary layer is cubic copper and the crystal of copper coating is mainly assigned to the (111) face.

Key words: additive electroless thick Cu plating THPED L-arginine ferrous potassium cyanide PEG

Received: 21 July 2010

ZTFLH:

TQ153.14

Corresponding Authors: REN Fengzhang E-mail: lyrenfz@163.com

	Service

	E-mail this article
	Add to citation manager
	E-mail Alert
	RSS
	（）
	Articles by authors
	SHEN Xiao-Ni
	DIAO Dong-Mei
	REN Feng-Zhang
	TIAN Bao-Hong

Cite this article:

SHEN Xiaoni, ZHAO Dongmei, REN Fengzhang, TIAN Baohong. INFLUENCES OF ADDITIVES ON ELECTROLESS THICK COPPER PLATING BASED ON THPED SYSTEM. J Chin Soc Corr Pro, 2011, 31(5): 362-366.

URL:

https://www.jcscp.org/EN/ OR https://www.jcscp.org/EN/Y2011/V31/I5/362

[1] Fang J L. Theory and Application of Electroplating Additives [M]. Beijing: National Defence Industry Press, 2007

    (方景礼. 电镀添加剂理论与应用 [M]. 北京: 国防工业出版社, 2007)

[2] Li D P, Yang C L. Acidic electroless copper deposition on aluminum-seeded ABS plastics [J].Surf. Coat. Technol., 2009, 203: 3559-3568

[3] Wang G J, Wang D Z. Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique [J]. Rare Met.,2008, 27(4): 434-438

[4] Lee C Y, Won C M, Jung S B. Surface finishes of rolled copper foil for flexible printed circuit board [J]. Mater. Sci. Eng., A, 2008,483/484(15): 723-726

[5] Sridhar A, Van Dijk D J, Akkerman R. Ink jet printing and adhesion characterization of conductive tracks on a commercial printed circuit board material [J]. Thin Solid Films, 2009, 517(16): 4633-4637

[6] Noh B I, Lee J B, Jung S B. Effect of surface finish material on printed circuit board for electrochemical migration [J]. Microelectron.Reliab., 2008, 48(4): 652-656

[7] Yang F Z, Yang B, Lu B B, et al. Electrochemical study on electroless copper plating using sodium hypophosphite as reductant [J]. Acta Physico-Chim.Sin., 2006, 22(11): 1317-1321

[8] Ando S, Endoh M, Nakamura T. Electrolytic copper-plated R-T-B magnet and plating method thereof [P]. U.S. Pat., 6866765, 2005

[9] Donahue F M, Sajkowski D J, Bosio A C. Kinetics of electroless copper plating inhibition by adsorption of ligand [J]. J. Electrochem. Soc., 1982,129(4): 717-719

[10] Zheng Y J, Zhou W H, Yi D Q, et al. Electroless copper plating in the presence of THPED and EDTA•2Na as the dual-chelating agent [J]. Mater.Prot., 2006, 39(2): 20-24

     (郑雅杰, 邹伟红, 易丹青等. 四羟丙基乙二胺和EDTA•2Na盐化学镀铜体系研究 [J]. 材料保护, 2006, 39(2): 20-24)

[11] Zhou W H. Fast copper plating process and mechanism [D]. Changsha: Central South University, 2006

     (邹伟红. 快速化学镀铜工艺及机理研究 [D]. 长沙: 中南大学, 2006)

[12] Li C H. Study on electroless copper plating technology of high plating rate in triethanolamine and EDTA$\cdot $ 2nd [D]. Changsha: Central South University, 2007

     (李春华. 三乙醇胺和EDTA$\cdot$2Na双配合体快速化学镀铜研究 [D]. 长沙: 中南大学, 2007)

[13] Hu G H, Yang F Z, Wu H H. The effect of additives on electroless copper plating on ceramic surface [J]. Electroplat. Finish., 2002, 21(3): 26

     (胡光辉, 杨防祖, 吴辉煌. 添加剂对化学镀铜的影响 [J]. 电镀与涂饰, 2002, 21(3): 26)

[14] Geng X, Bai Y Q, Ren G N, et al. Physical chemistry of the electroless copper [J]. J.Shenyang Univ. Technol., 2006,28(2): 225-229

     (耕新, 白艳秋, 任公年等. 化学镀铜的物理化学 [J]. 沈阳工业大学学报, 2006, 28(2): 225-229)

[15] Xu X C, Huang S K. The control degree of cathodic and anodic reactions in electroless copper plating system of Cu(II)-EDTA-HCHO [J]. Plat.Finish., 1987, 9(6): 12-14

     (徐喜初, 黄树坤. Cu(II)-EDTA-HCHO化学镀铜中阴、阳极反应的控制程度 [J].电镀与精饰, 1987, 9(6): 12-14)

[16] Wang C L, Wang Y E, Qu P, et al. Multilayer flexible PCB electroless copper plating technology research [J]. Print. Circuit Board Inf., 2009, 5: 84-86

     (汪传林, 王勇恩, 屈鹏等. 多层柔性线路板化学镀铜工艺研究 [J]. 印制电路资讯, 2009, 5: 84-86)\par

[1]	CUI Xuejun, BAI Chengbo, ZHU Yibo, MIN Hongyun, WANG Rong, LIN Xiuzhou. Effect of Additives Mn(NO₃)₂ and/or Na₂MoO₄ on Micro-morphology and Corrosion Performance of Phosphate Coating on AZ31B Magnesium Alloy[J]. 中国腐蚀与防护学报, 2014, 34(5): 477-482.
[2]	XIONG Yuanyuan,ZHANG Ya,HU Shaofeng,CHEN Qiurong^,,XIE Youtao. Effects of Additions of La(CH₃COO)₃and NaF on Electrochemical Behavior of AZ31 Alloys in Mg(ClO₄)₂ Solution[J]. 中国腐蚀与防护学报, 2013, 33(3): 241-244.
[3]	LONG Yingchun, LI Wenfang, ZHANG Guoge, YU Fei. INFLUENCE OF ADDITIVE ON PREPARATION OF BLACK CERAMIC COATING ON ALUMINUM ALLOY BY MICRO-ARC OXIDATION METHOD[J]. 中国腐蚀与防护学报, 2012, 32(5): 388-392.
[4]	DU Nan, SHU Weifa, WANG Chunxia, WANG Shuaixing, CHEN Qinglong. FUNCTION OF A COMBINATORIAL ADDITIVE ON ALKALINE NON-CYANIDE ZINC PLATING[J]. 中国腐蚀与防护学报, 2012, 32(3): 251-255.
[5]	WANG Sheng-xian LIN Wei-wei (Department of Polymer Science and Engineering; Zhejiang University; Hangzhou 310027)CENG Sao-an ZHANG Jian-qing (Department of Chemisty; Zhejiang University; Hangzhou 310027). CORROSION PREVENTION OF REINFORCING STEEL BY ACRYLIC LATEX[J]. 中国腐蚀与防护学报, 1998, 18(3): 198-202.

No Suggested Reading articles found!

Viewed

Full text

Abstract

Cited

Shared

Discussed