外加电位下<strong>Ag/Sn</strong>电偶的腐蚀行为

doi:10.11902/1005.4537.2023.214

中国腐蚀与防护学报

2024, Vol. 44

Issue (3): 700-706 CSTR: 32134.14.1005.4537.2023.214 DOI: 10.11902/1005.4537.2023.214

研究报告

本期目录 | 过刊浏览

外加电位下Ag/Sn电偶的腐蚀行为

戴威, 刘园园, 涂闻芮, 孙阳庭(

), 李劲, 蒋益明

复旦大学材料科学系上海 200438

Corrosion Behavior of Ag/Sn Galvanic Couple at Applied Potential

DAI Wei, LIU Yuanyuan, TU Wenrui, SUN Yangting(

), LI Jin, JIANG Yiming

Department of Materials Science, Fudan University, Shanghai 200438, China

引用本文:

戴威, 刘园园, 涂闻芮, 孙阳庭, 李劲, 蒋益明. 外加电位下Ag/Sn电偶的腐蚀行为[J]. 中国腐蚀与防护学报, 2024, 44(3): 700-706.
Wei DAI, Yuanyuan LIU, Wenrui TU, Yangting SUN, Jin LI, Yiming JIANG. Corrosion Behavior of Ag/Sn Galvanic Couple at Applied Potential[J]. Journal of Chinese Society for Corrosion and protection, 2024, 44(3): 700-706.

全文: PDF(14664 KB) HTML

摘要:

针对SAC焊料的腐蚀，采用开路电位和极化曲线测试、双极性电化学测试方法在NaCl溶液中研究了外加电位下Ag/Sn电偶的腐蚀行为。结果表明，Sn的OCP低于Ag，在高电位下，Sn发生严重腐蚀，Ag表面生成AgCl，阻碍了基体的进一步溶解；低电位下，Sn发生阴极腐蚀。

关键词 ：双极性电化学, SAC焊料, Ag腐蚀, Sn腐蚀, 枝晶

Abstract：

In practical application, the selective oxidation of Ag₃Sn in Sn-Ag-Cu (SAC) solder will take place to form pure Ag, resulting in the formation of Ag/Sn galvanic couple. As development of electronic devices tends to miniature while high performance, the solder joints decrease in size, the in-between gaps become narrower, these factors lead to the increase in the intensity of the local electric field around solder joints. As a consequence, the corrosion behavior of SAC solder may change. In this paper, the corrosion of Ag/Sn galvanic couple under different applied potentials was studied by open-circuit potential and potentiodynamic polarization test and bipolar electrochemistry test. The results show that the OCP of Sn was lower than that of Ag. At high applied potential, Sn suffered severe corrosion while the formation of AgCl inhibited the dissolution of Ag; at low applied potential, Sn suffered cathodic corrosion.

Key words： bipolar electrochemistry SAC solder Ag corrosion Sn corrosion dendrite

收稿日期: 2023-07-07 32134.14.1005.4537.2023.214

ZTFLH:

TG172

基金资助:国家自然科学基金(52071082);上海市自然科学基金(21ZR1406500)

通讯作者: 孙阳庭，E-mail：sunyangting@fudan.edu.cn，研究方向为电子材料功能金属腐蚀与防护、钝性合金局部腐蚀

Corresponding author: SUN Yangting, E-mail: sunyangting@fudan.edu.cn

作者简介: 戴威，男，1997年生，博士生

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https://www.jcscp.org/CN/10.11902/1005.4537.2023.214 或 https://www.jcscp.org/CN/Y2024/V44/I3/700

图1 双极性电化学测试装置和样品示意图

图2 Ag和Sn在0.01 mol/L NaCl溶液中的OCP

图3 Ag和Sn在0.01 mol/L NaCl溶液中的动电位极化曲线

图4 Ag在0.01 mol/L NaCl溶液中极化曲线测试后的形貌和SEM和EDS表征

图5 Sn在0.01 mol/L NaCl溶液中极化曲线测试后的形貌和SEM/EDS表征

图6 Ag和Sn在0.01 mol/L NaCl溶液中经过10 min双极性电化学测试后的光镜形貌和SEM和EDS结果

1	Pecht M, Shibutani T, Wu L F. A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded [J]. Microelectron. Reliab., 2016, 62: 113 doi: 10.1016/j.microrel.2016.03.020
2	Tunthawiroon P, kanlayasiri K. Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate [J]. Trans. Nonferrous Met. Soc. China, 2019, 29: 1696 doi: 10.1016/S1003-6326(19)65076-4
3	Fazal M A, Liyana N K, Rubaiee S, et al. A critical review on performance, microstructure and corrosion resistance of Pb-free solders [J]. Measurement, 2019, 134: 897 doi: 10.1016/j.measurement.2018.12.051
4	Keller J, Baither D, Wilke U, et al. Mechanical properties of Pb-free SnAg solder joints [J]. Acta Mater., 2011, 59: 2731 doi: 10.1016/j.actamat.2011.01.012
5	Gharaibeh A, Felhősi I, Keresztes Z, et al. Electrochemical corrosion of SAC alloys: a review [J]. Metals, 2020, 10: 1276 doi: 10.3390/met10101276
6	Tian Y, Ren N, Zhao Z H, et al. Ag₃Sn compounds coarsening behaviors in micro-joints [J]. Materials, 2018, 11: 2509 doi: 10.3390/ma11122509
7	Comizzoli R B, Frankenthal R P, Milner P C, et al. Corrosion of electronic materials and devices [J]. Science, 1986, 234: 340 pmid: 17834532
8	Yan Z, Xian A P. Pitting corrosion behavior of Sn-0.7Cu lead-free alloy in simulated marine atmospheric enviroment and the effect of trace Ga [J]. Acta Metall. Sin., 2011, 47: 1327
8	颜忠, 冼爱平. 人工模拟海洋大气环境下Sn-0.7Cu无铅焊料的点蚀行为及微量Ga的影响 [J]. 金属学报, 2011, 47: 1327
9	Song F B, Lee S W R. Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability [A]. 56th Electronic Components and Technology Conference 2006 [C]. San Diego, 2006
10	Wang M N, Wang J Q, Feng H, et al. Effect of Ag₃Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition [J]. Corros. Sci., 2012, 63: 20 doi: 10.1016/j.corsci.2012.05.006
11	Wang M N, Wang J Q, Ke W. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints [J]. Microelectron. Reliab., 2017, 73: 69 doi: 10.1016/j.microrel.2017.04.017
12	Liao B K, Cen H Y, Chen Z Y, et al. Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers [J]. Corros. Sci., 2018, 143: 347 doi: 10.1016/j.corsci.2018.08.041
13	Chen G, Wang X H, Yang J, et al. Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders [J]. Microelectron. Reliab., 2020, 108: 113634 doi: 10.1016/j.microrel.2020.113634
14	Wang M N, Qiao C, Jiang X L, et al. Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere [J]. J. Mater. Sci. Technol., 2020, 51: 40 doi: 10.1016/j.jmst.2020.03.024
15	Yi P, Dong C F, Xiao K, et al. Study on corrosion behavior of β-Sn and intermetallic compounds phases in SAC305 alloy by in-situ EC-AFM and first-principles calculation [J]. Corros. Sci., 2021, 181: 109244 doi: 10.1016/j.corsci.2021.109244
16	Qiao C, Sun X, Wang Y Z, et al. A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder [J]. Mater. Lett., 2021, 297: 129935 doi: 10.1016/j.matlet.2021.129935
17	Zhong X K, Lu W J, Liao B K, et al. Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy [J]. Corros. Sci., 2019, 156: 10 doi: 10.1016/j.corsci.2019.05.004
18	Sun X. Structure and corrosion behavior of the oxide film formed on Sn-based Pb-free solder [D]. Shenyang: Shenyang Ligong University, 2022
18	孙旭. 锡基无铅焊料表面氧化膜膜层结构及腐蚀性能表征 [D]. 沈阳: 沈阳理工大学, 2022
19	Xiao K, Zou S W, Dong C F, et al. Atmospheric Corrosion Behavior and Mechanism of Electronic Materials [M]. Beijing: Chemical Industry Press, 2020
19	肖葵, 邹士文, 董超芳等. 电子材料大气腐蚀行为与机理 [M]. 北京: 化学工业出版社, 2020
20	Teng L, Chen X. Research progress of galvanic corrosion in marine environment [J]. J. Chin. Soc. Corros. Prot., 2022, 42: 531
20	滕琳, 陈旭. 海洋环境中金属电偶腐蚀研究进展 [J]. 中国腐蚀与防护学报, 2022, 42: 531
21	Liu J Z, Xing S H, Qian Y, et al. Galvanic corrosion behavior of 20# steel/tin bronze couple in flowing seawater [J]. J. Chin. Soc. Corros. Prot., 2023, 43: 127
21	刘近增, 邢少华, 钱峣等. 20#钢/锡青铜偶对在流动海水中的电偶腐蚀行为研究 [J]. 中国腐蚀与防护学报, 2023, 43: 127 doi: 10.11902/1005.4537.2022.001
22	Xing S H, Liu J Z, Bai S Y, et al. Influence of seawater flow speed on galvanic corrosion behavior of B10/B30 alloys coupling [J]. J. Chin. Soc. Corros. Prot., 2023, 43: 391
22	邢少华, 刘近增, 白舒宇等. 海水流速对B10/B30电偶腐蚀行为影响规律研究 [J]. 中国腐蚀与防护学报, 2023, 43: 391 doi: 10.11902/1005.4537.2022.109
23	Dai W, Liu Y Y, Huang N G, et al. Selective corrosion of β-Sn and intermetallic compounds in an Ag–Sn alloy at different potentials in NaCl and Na₂SO₄ solutions [J]. Corros. Sci., 2023, 212: 110958 doi: 10.1016/j.corsci.2022.110958
24	Munktell S, Tydén M, Högström J, et al. Bipolar electrochemistry for high-throughput corrosion screening [J]. Electrochem. Commun., 2013, 34: 274 doi: 10.1016/j.elecom.2013.07.011
25	Li D Z, Conway P P, Liu C Q. Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution [J]. Corros. Sci., 2008, 50: 995 doi: 10.1016/j.corsci.2007.11.025
26	Rosalbino F, Angelini E, Zanicchi G, et al. Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution [J]. Electrochim. Acta, 2009, 54: 7231 doi: 10.1016/j.electacta.2009.07.030
27	Cao C N. Principle of Corrosion Electrochemistry [M]. 2nd ed. Beijing: Chemical Industry Press, 2004
27	曹楚南. 腐蚀电化学原理 [M]. 2版. 北京: 化学工业出版社, 2004
28	Pourbaix M. Atlas of Electrochemical Equilibria in Aqueous Solutions [M]. 2d ed. Houston: National Association of Corrosion Engineers, 1974
29	Haynes W M. CRC Handbook of Chemistry and Physics [M]. 95th ed. Boca Raton: CRC Press, 2014
30	Alvarez P E, Ribotta S B, Folquer M E, et al. Potentiodynamic behaviour of tin in different buffer solutions [J]. Corros. Sci., 2002, 44: 49 doi: 10.1016/S0010-938X(01)00032-4
31	Bui Q V, Nam N D, Noh B I, et al. Effect of Ag addition on the corrosion properties of Sn-based solder alloys [J]. Mater. Corros., 2010, 61: 30
32	Minzari D, Jellesen M S, Møller P, et al. On the electrochemical migration mechanism of tin in electronics [J]. Corros. Sci., 2011, 53: 3366 doi: 10.1016/j.corsci.2011.06.015

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