中国腐蚀与防护学报, 2024, 44(3): 700-706 DOI: 10.11902/1005.4537.2023.214

研究报告

外加电位下Ag/Sn电偶的腐蚀行为

戴威, 刘园园, 涂闻芮, 孙阳庭,, 李劲, 蒋益明

复旦大学材料科学系 上海 200438

Corrosion Behavior of Ag/Sn Galvanic Couple at Applied Potential

DAI Wei, LIU Yuanyuan, TU Wenrui, SUN Yangting,, LI Jin, JIANG Yiming

Department of Materials Science, Fudan University, Shanghai 200438, China

通讯作者: 孙阳庭,E-mail:sunyangting@fudan.edu.cn,研究方向为电子材料功能金属腐蚀与防护、钝性合金局部腐蚀

收稿日期: 2023-07-07   修回日期: 2023-08-08  

基金资助: 国家自然科学基金.  52071082
上海市自然科学基金.  21ZR1406500

Corresponding authors: SUN Yangting, E-mail:sunyangting@fudan.edu.cn

Received: 2023-07-07   Revised: 2023-08-08  

Fund supported: National Natural Science Foundation of China.  52071082
Natural Science Foundation of Shanghai.  21ZR1406500

作者简介 About authors

戴威,男,1997年生,博士生

摘要

针对SAC焊料的腐蚀,采用开路电位和极化曲线测试、双极性电化学测试方法在NaCl溶液中研究了外加电位下Ag/Sn电偶的腐蚀行为。结果表明,Sn的OCP低于Ag,在高电位下,Sn发生严重腐蚀,Ag表面生成AgCl,阻碍了基体的进一步溶解;低电位下,Sn发生阴极腐蚀。

关键词: 双极性电化学 ; SAC焊料 ; Ag腐蚀 ; Sn腐蚀 ; 枝晶

Abstract

In practical application, the selective oxidation of Ag3Sn in Sn-Ag-Cu (SAC) solder will take place to form pure Ag, resulting in the formation of Ag/Sn galvanic couple. As development of electronic devices tends to miniature while high performance, the solder joints decrease in size, the in-between gaps become narrower, these factors lead to the increase in the intensity of the local electric field around solder joints. As a consequence, the corrosion behavior of SAC solder may change. In this paper, the corrosion of Ag/Sn galvanic couple under different applied potentials was studied by open-circuit potential and potentiodynamic polarization test and bipolar electrochemistry test. The results show that the OCP of Sn was lower than that of Ag. At high applied potential, Sn suffered severe corrosion while the formation of AgCl inhibited the dissolution of Ag; at low applied potential, Sn suffered cathodic corrosion.

Keywords: bipolar electrochemistry ; SAC solder ; Ag corrosion ; Sn corrosion ; dendrite

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本文引用格式

戴威, 刘园园, 涂闻芮, 孙阳庭, 李劲, 蒋益明. 外加电位下Ag/Sn电偶的腐蚀行为. 中国腐蚀与防护学报[J], 2024, 44(3): 700-706 DOI:10.11902/1005.4537.2023.214

DAI Wei, LIU Yuanyuan, TU Wenrui, SUN Yangting, LI Jin, JIANG Yiming. Corrosion Behavior of Ag/Sn Galvanic Couple at Applied Potential. Journal of Chinese Society for Corrosion and Protection[J], 2024, 44(3): 700-706 DOI:10.11902/1005.4537.2023.214

焊接是电子封装中重要的一环,Sn-Pb合金是其中常用的焊料合金。由于重金属Pb的毒害作用,自2006年以来,世界各国逐渐禁用Sn-Pb焊料,转而使用无铅焊料[1~3],其中,Sn-Ag-Cu (SAC)焊料被认为最有希望替代Sn-Pb焊料[4~6]。腐蚀是造成电子器件失效的最重要因素之一,微量的腐蚀即会影响电子器件的性能,甚至导致失效[7]。因此,研究无铅焊料的腐蚀对于保障电子器件的可靠性至关重要[8]

SAC焊料的腐蚀研究表明,焊料组织中的Sn基体与金属间化合物(IMC),如Ag3Sn、Cu6Sn5形成腐蚀电偶,Sn发生腐蚀,而IMC不腐蚀[9~12]。原因是,在热力学上,Ag3Sn、Cu6Sn5的电极电位较高[13,14];在动力学上,Sn更容易发生电荷转移过程[15]。因此,Sn作为腐蚀电偶中的阳极发生腐蚀,而IMC作为阴极受到保护。

SAC焊料中的Ag3Sn在服役过程中会发生选择性氧化,生成纯Ag[10,16]。纯Ag与焊料中的Sn基体形成Ag/Sn电偶。在外加电压的作用下,可能会导致焊料的腐蚀行为发生改变。Zhong等[17]研究表明,在NaCl溶液条件下,当外加电位比较高时,SAC焊料发生腐蚀和电化学迁移,生成的枝晶中含有Ag,该研究表明,SAC焊料中的Ag3Sn发生选择性氧化,导致焊料表面出现纯Ag,在高电位作用下,Ag发生腐蚀,溶出的金属离子在阴极还原形成Ag枝晶。Ag的电极电位比Sn的高,即在热力学上,Ag比Sn更不容易发生腐蚀[13]。在无外加电位条件下,Ag与Sn形成电偶时,Sn作为阳极优先发生腐蚀[18]。对于外加电位的影响,文献中未有详细报道。此外,浸银(ImAg)是一种常用的印刷电路板(PCB)表面处理工艺,焊料中的Sn容易与Ag形成腐蚀电偶[19],电偶腐蚀是一种重要的腐蚀形式[20~22]。因此,研究外加电位下对Ag/Sn电偶的腐蚀行为,揭示其腐蚀机理,对于电子器件的可靠性研究具有重要价值。

微量的Cl-常见于电子器件的服役环境中,因此,本文以0.01 M NaCl为介质,首先通过开路电位和极化曲线测试揭示纯Ag和纯Sn的基本腐蚀行为,在此基础上,采用双极性电化学技术研究Ag/Sn电偶在不同外加电位下的腐蚀行为,并对测试后的样品进行光学显微镜、扫描电子显微镜/能谱(SEM/EDS)表征,分析外加电位对Ag/Sn电偶的腐蚀行为的影响。

1 实验方法

实验材料为纯金属Ag和Sn,纯度均为99.99%。对于极化曲线测试实验,样品的尺寸为12 mm × 12 mm × 3 mm,样品的背面通过焊接与导线连接,再封入环氧树脂中作为工作电极,表面露出作为测试面,控制暴露尺寸为10 mm × 10 mm。在进行电化学实验之前,所有的工作电极用水磨砂纸逐级打磨至2000#,接着使用2.5 μm金刚石抛光膏进行机械抛光,最后依次使用去离子水、乙醇和丙酮清洗样品表面并用冷风吹干。实验溶液为0.01 mol/L NaCl。

采用CHI660E型电化学工作站进行极化曲线测试,测试温度为25℃。实验装置为标准的三电极体系,待测样品作为工作电极,Pt片电极作为对电极,饱和甘汞电极(SCE)作为参比电极。在进行极化曲线测试之前,先将样品浸入实验溶液中,在开路状态下稳定1800 s,记录样品的开路电位(OCP)随时间的变化。随后,从-0.25 VOCP开始,以10 mV/min的速率向阳极方向对样品进行动电位扫描,终止电位为1.5 VSCE。为了保证数据的可重复性,每组极化曲线都进行3组平行实验。

双极性电化学技术的原理和特性在我们之前发表的文章中已有详述[23],其装置如图1a所示。两个驱动电极与直流电源相连,在溶液两端施加电压,进而在样品表面构建电势差梯度,可以在单一样品上揭示系列电位下的腐蚀形貌[24]。由于样品的两端分别发生氧化、还原反应,因此也被称为双极性电极。

图1

图1   双极性电化学测试装置和样品示意图

Fig.1   Schematic of bipolar electrochemistry test setup (a), top view (b) and side view (c) of bipolar electrode, ‘E’ represents the potential


本研究中,Ag/Sn电偶的制备过程如下:将纯Ag和纯Sn切割成尺寸为12 mm × 6 mm × 3 mm的方块,两个金属背面通过导线连接,形成电偶,然后封入环氧树脂中。控制两个金属的间距为2 mm。整个电极的暴露尺寸为10 mm × 10 mm,因此,纯Ag和纯Sn的实际暴露尺寸均为10 mm × 4 mm,如图1bc所示。测试过程中,外加电压恒定为20 V,测试温度为25℃,测试时间为10 min。

电化学实验结束后,用ZEISS Axiolab 5光学显微镜观察样品宏观腐蚀形貌,并采用自带能谱分析(EDS)的ZEISS Gemini 300扫描电子显微镜(SEM)进行腐蚀形貌观察及表征。由于光学显微镜所能拍摄的范围有限,对于双极性电化学测试后的样品,其光镜形貌照片是将各个区域的照片拼接后得到的,以展示样品在系列电位下的腐蚀全貌。

2 结果与讨论

2.1 AgSn的开路电位

Ag和Sn在0.01 mol/L NaCl溶液中的OCP如图2所示。Ag和Sn在NaCl溶液中的OCP分别为0.04和-0.68 VSCE。Ag的OCP高于Sn,表明Sn的腐蚀倾向高于Ag,这与文献的信息一致[15]。当Ag和Sn形成腐蚀电偶时,Sn倾向于作为阳极优先发生腐蚀。

图2

图2   Ag和Sn在0.01 mol/L NaCl溶液中的OCP

Fig.2   OCP of Ag and Sn in 0.01 mol/L NaCl solution


2.2 AgSn的极化曲线

Ag和Sn在0.01 mol/L NaCl溶液中的动电位极化曲线如图3所示。在NaCl溶液中,随着电位升高,Ag的阳极电流密度迅速增大,电位高于0.25 VSCE后,电流密度保持稳定,约在6.3×10-4 A/cm-2波动。Sn在电位低于-0.19 VSCE时处于钝化状态。随着电位上升,电流密度迅速升高,随后保持稳定。在0.9 VSCE左右,电流密度略有下降后又缓慢上升。在测试电位范围内,Sn的电流密度均大于Ag,表明在NaCl溶液中,Sn的腐蚀速率大于Ag。

图3

图3   Ag和Sn在0.01 mol/L NaCl溶液中的动电位极化曲线

Fig.3   Polarization curves of Ag and Sn in 0.01 mol/L NaCl solution


Ag在0.01 mol/L NaCl溶液中极化曲线测试后的形貌和SEM/EDS表征结果如图4所示。光镜和SEM结果(图4ab)显示,Ag表面有腐蚀产物覆盖,主要成分是AgCl (图4cd)。腐蚀产物对基体粘附力比较弱,水流冲洗后部分产物发生脱落。产物膜呈现双层结构,外层疏松多孔(图4e),内层较为致密(图4f),二者的EDS成分结果有所区别,可能是因为厚度不同,导致基体Ag的信号强度不一样(图4hi)。产物膜下方是Ag基体,表面因为腐蚀而变得不平整(图4g),Cl含量很少(图4j)。上述结果表明,Ag在NaCl溶液中极化曲线测试时形成AgCl产物膜覆盖在基体表面,阻碍了离子的扩散。在极化曲线上表现为电位高于0.25 VSCE后,Ag的电流密度基本不变,即达到了极限扩散电流密度。

图4

图4   Ag在0.01 mol/L NaCl溶液中极化曲线测试后的形貌和SEM和EDS表征

Fig.4   Optical image (a), SEM image (b), element distribution maps (c, d) and magnified views (e‒g) of Fig.4b, EDS results of points in Fig.4e-g (h‒j) of Ag after polarization in 0.01 mol/L NaCl solution


Sn在0.01 mol/L NaCl溶液中极化曲线测试后的形貌和SEM/EDS表征结果如图5所示。在NaCl溶液中,Sn发生严重腐蚀,生成片状的腐蚀产物(图5a~e),腐蚀产物含有大量的Cl和O(图5f~h),据文献[25,26]报道,可能是Sn3O(OH)2Cl2,其形成过程为:

3Sn+2Cl-+4OH-Sn3OOH2Cl2+H2O+6e-

图5

图5   Sn在0.01 mol/L NaCl溶液中极化曲线测试后的形貌和SEM/EDS表征

Fig.5   Optical image (a), SEM images (b, f), element distribution maps of Fig.5b (c‒e) and EDS result of points in Fig.5f (g, h) of Sn after polarization in 0.01 mol/L NaCl solution


反映在极化曲线上是高电位下,Sn的电流密度较高。

2.3 Ag/Sn电偶的双极性电化学测试

Ag和Sn在0.01 mol/L NaCl溶液中经过10 min 双极性电化学测试后的光镜形貌和SEM/EDS结果如图6所示。样品靠近电源正极的一端电位较低,样品上的电位呈线性分布[23]。Ag和Sn随着外加电位改变而呈现出不同的腐蚀形貌。高电位下,Ag表面在光镜下呈黑色,SEM/EDS结果表明,Ag表面腐蚀轻微,黑色物质是腐蚀产物Ag2O和AgCl的混合物(图6a2~a3),和极化曲线测试后的结果类似,腐蚀产物膜的形成阻碍了Ag的阳极溶解。随着外加电位降低,Ag表面不发生腐蚀,表现出良好的耐腐蚀性能(图6a1)。

图6

图6   Ag和Sn在0.01 mol/L NaCl溶液中经过10 min双极性电化学测试后的光镜形貌和SEM和EDS结果

Fig.6   SEM images and EDS results of the Ag (a1-a3) of zones 1, 2, and 3 in Fig.6a and Sn (b1-b3) of zones 1, 2, and 3 in Fig.6b after the BPE test for 10 min in 0.01 mol/L NaCl solution


Sn在高电位下发生严重腐蚀,表面出现大量的腐蚀坑,EDS元素分析结果表明,腐蚀产物含有大量的O和Cl(图6b3)。随着电位降低,Sn的腐蚀程度降低,表面的腐蚀坑尺寸减小(图6b2)。电位进一步降低,Sn不发生腐蚀,光镜下呈黑色,原因是Sn颗粒在表面沉积。Sn颗粒的形成过程为:Sn在高电位区域(右侧)发生溶解,溶出的金属离子向低电位迁移,当电位到达临界值时,金属离子发生还原反应,生成Sn沉积在样品的表面。在更低电位处,Sn由于发生阴极腐蚀而形成腐蚀坑(图6b1),在极化曲线测试中,阴极腐蚀是难以分辨的,因为极化曲线测试后的形貌是所有电位下的腐蚀形貌的叠加。

2.4 讨论

在水溶液中,Pourbaix图可以作为判断金属体系腐蚀状态的热力学判据[27,28]。根据Ag和Sn在含S和含Cl体系中的Pourbaix图[23]。在NaCl溶液中,对于Ag,当电位高于一定值时,Ag表面会生成AgCl

Ag+Cl-=AgCl+e-

AgCl在水溶液中的溶解度较低(Ksp(AgCl) =1.77×10-10)[29],因此,生成的AgCl沉积在Ag的表面形成产物膜,会阻碍基体进一步发生溶解。随着电位降低,Ag进入免蚀状态。

对于Sn,高电位下,Sn表面会生成Sn的氧化物(氢氧化物),使Sn表面进入钝化状态[25,30]。然而,双极性电化学测试和极化曲线测试的结果均表明,Sn在NaCl溶液中在电位较高的条件下发生严重的腐蚀(图56b)。其原因为:Cl-半径比较小,容易穿透Sn表面的氧化物膜,进入到金属/氧化物膜界面,与Sn形成腐蚀产物,导致氧化物膜发生破裂,最终在Sn表面形成腐蚀坑[12]。此时,腐蚀坑内的Sn继续溶解,溶出的金属离子发生水解产生H+

Sn2++2H2OSn(OH)2+2H+
Sn4++4H2OSn(OH)4+4H+

导致蚀坑内部环境酸化[31,32]。在酸性条件下,SnCl3-SnCl62-的生成会加速Sn的活性溶解。因此,在NaCl溶液中,当电位较高时,Sn发生严重腐蚀。

电位降低,Sn进入免蚀状态。当电位进一步降低时,SnH4生成:

Sn+4H++4e-=SnH4

导致Sn发生阴极腐蚀。

因此,在NaCl溶液中,Ag/Sn电偶中的Sn在高电位和Cl-的共同作用下发生严重腐蚀,Ag由于表面形成AgCl产物膜,腐蚀速率降低。在极化曲线中表现为Sn在高电位下的电流密度高于Ag,即Sn的腐蚀速率高于Ag。电位降低,Ag和Sn不发生腐蚀。在低电位下,Sn发生阴极腐蚀。由此可见,Pourbaix图反映金属基本的热力学腐蚀倾向,而双极性电化学测试则能够快速揭示金属的动力学腐蚀和稳定区域。

3 结论

本文针对SAC焊点材料的腐蚀,采用单金属Ag和Sn,结合开路电位和极化曲线测试、双极性电化学测试方法研究外加电位下Ag/Sn电偶的腐蚀行为,得到以下结论:

(1) Sn在NaCl溶液中的OCP低于Ag,表明Sn的热力学腐蚀倾向高于Ag。

(2) 在NaCl溶液中,Sn的腐蚀电流始终大于Ag,Ag表面生成较为致密的AgCl膜,阻碍基体溶解。

(3) 双极性电化学测试能够同时揭示Ag/Sn电偶在系列外加电位下的腐蚀形貌,具有高通量的特性。Sn在低电位下发生阴极腐蚀,在高电位下,NaCl溶液中,由于Cl-的强侵蚀性,Sn发生严重腐蚀。

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As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great significance. This study focused on coarsening behaviors of Ag3Sn compounds in Sn-3.0Ag-0.5Cu (SAC305) micro-joints of flip chip assemblies using thermal shock (TS) tests. The results showed that the Ag3Sn compounds grew and rapidly coarsened into larger ones as TS cycles increased. Compared with such coarsening behaviors during thermal aging, TS exhibited a significantly accelerating influence. This predominant contribution is quantitatively determined to be induced by strain-enhanced aging. Moreover, based on observations for Ag3Sn microstructure evolutions during TS cycling, one particular finding showed that there are two types of coarsening modes (i.e., Ostwald ripening and Necking coalescence) co-existing in the Ag3Sn coarsening process. The corresponding evolutions mechanism was elucidated in a combination of simulative analysis and experimental validation. Furthermore, a kinetic model of the Ag3Sn coarsening was established incorporating static aging and strain-enhanced aging constant, the growth exponent (n) was calculated to be 1.70, and the predominant coarsening mode was confirmed to be the necking coalescence.

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Electronic materials and devices corrode in the same ways as automobiles, bridges, and pipelines, but their typically small dimensions make them orders of magnitude more susceptible to corrosion failure. As elsewhere, the corrosion involves interactions with the environment. Under control, these interactions can be put to use, as in the formation of protective and functional oxide films for superconducting devices. Otherwise, they cause damage, as in the electrolytic dissolution of conductors, even gold, in the presence of humidity and ionic contamination from atmospheric particles and gases. Preventing corrosion entails identifying the damaging interactions and excluding species that allow them to occur.

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Motivated by the increasing use of Sn-3.0Ag-0.5Cu (SAC305) solder in electronics worked in marine atmospheric environment and the uneven distribution of Ag3Sn and Cu6Sn5 intermetallic compounds (IMCs) in β-Sn matrix, comb-like electrodes have been designed for in-situ EIS measurements to study the microstructure induced galvanic corrosion evolution of SAC305 solder in simulated marine atmosphere with high-temperature and high-humidity. Results indicate that in-situ EIS measurement by comb-like electrodes is an effective method for corrosion evolution behavior study of SAC305 solder. Besides, the galvanic effect between Ag3Sn IMCs and β-Sn matrix can aggravate the corrosion of both as-received and furnace-cooled SAC305 solder as the exposure time proceeds in spite of the presence of corrosion product layer. Pitting corrosion can be preferentially found on furnace-cooled SAC305 with larger Ag3Sn grain size. Moreover, the generated inner stress during phases transformation process with Sn3O(OH)2Cl2 as an intermediate and the possible hydrogen evolution at local acidified sites are supposed to be responsible for the loose, porous, cracked, and non-adherent corrosion product layer. These findings clearly demonstrate the corrosion acceleration behavior and mechanism of SAC305 solder, and provide potential guidelines on maintenance of microelectronic devices for safe operation and longer in-service duration.

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20#钢穿舱件和锡青铜阀电偶腐蚀是船舶海水管路系统严重腐蚀部位之一。为控制20#钢/锡青铜电偶腐蚀延长海水管路系统寿命,本文通过原位测量20#钢管材和ZCuSn5Pb5Zn5锡青铜管材在静态以及1、3和5 m/s流速海水中的电偶电位和电偶电流,分析电偶腐蚀速率随时间和流速的变化规律;同时采用扫描电镜 (SEM) 和激光Raman光谱仪分析腐蚀形貌和腐蚀产物组分。结果表明,在不同流速海水中,20#钢与ZCuSn5Pb5Zn5合金间存在明显的电偶腐蚀倾向,20#钢作为阳极加剧腐蚀,ZCuSn5Pb5Zn5合金作为阴极受到保护;相比于静态海水,20#钢阳极极化电流密度和ZCuSn5Pb5Zn5合金阴极极化电流密度在流动海水中显著增加,电偶腐蚀显著加剧,1 m/s流速下的电偶腐蚀速率是静态下的17.5倍;当海水流速达到5 m/s后,20#钢表面形成了致密性较高、活性低的腐蚀产物沉积层,电偶腐蚀速率减小。

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海水流速对B10/B30电偶腐蚀行为影响规律研究

[J]. 中国腐蚀与防护学报, 2023, 43: 391

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B10和B30铜镍合金分别为船舶海水管路和冷却器的主要材料,二者由于镍含量不同腐蚀电位不同,管路与冷却设备连接后,B10和B30存在电偶腐蚀风险,特别是在流动海水加速腐蚀介质和腐蚀产物扩散工况条件。为控制B10/B30电偶腐蚀以延长海水管路系统使用寿命,本文通过电化学法测试了B10和B30管状偶对在静态以及1、3和5 m/s流速海水中的电偶电位和电偶电流,分析电偶腐蚀速率随时间和流速的变化规律。研究结果表明:在静态海水中,B10与B30的电偶腐蚀倾向较小,试验初期B10作为阳极腐蚀略有增加,实验40 h后电偶电流趋近于零;流动海水中,B10阳极极化电流密度和B30阴极极化电流密度显著增加,B10始终作为阳极电偶腐蚀显著加剧,1 m/s流速下的电偶腐蚀速率是静态下的79倍,且随着海水流速的增大,B10/B30电偶电流密度增大,电偶腐蚀速率加快,混合电位理论分析表明B10/B30电偶腐蚀速率是由B10阳极反应动力学和B30阴极反应动力学共同控制。

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