用原子力显微镜研究铜合金微生物的腐蚀行为

中国腐蚀与防护学报

2008, Vol. 28

Issue (6期): 321-324

研究报告

本期目录 | 过刊浏览

用原子力显微镜研究铜合金微生物的腐蚀行为

杜一立¹;李进²;葛小鹏²;苑维双²

1. 北京交通大学市政与环境工程系
2. 中国科学院生态环境研究中心

AFM STUDY OF MICROBIOLOGICALLY INFLUENCED CORROSION OF COPPER ALLOYS

DU Yili1; LI Jin1; GE Xiaopeng2; YUAN Weishuang1

1. Department of Municipal and Environmental Engineering; Beijing Jiaotong University; Beijing 100044
2. Research Center for Eco-Environmental Science; Chinese Academy of Sciences; Beijing 100085

全文: PDF(1029 KB)

摘要:

用原子力显微镜（AFM）研究了HSn70-1A、HSn70-1B和HSn70-1AB等 3种铜合金在硫酸盐还原菌（SRB）菌液中的微生物腐蚀行为。结果表明，3种铜合金表面形成的生物膜形貌各不相同。HSn70-1AB合金表面生物膜的粗糙度大于其余两种合金，表明其生物膜最不均匀。去除生物膜后，3种样品的腐蚀形貌也不相同，粗糙度均有所增加，这是微生物腐蚀作用的结果。研究证实，AFM的定量分析能力是研究材料微生物腐蚀的重要手段。

关键词 ：原子力显微镜, 微生物腐蚀, 生物膜

Abstract：

Atomic force microscopy （AFM） was applied to investigate the microbiologically influenced corrosion of copper alloys immerged in the sulfate reducing bacteria （SRB） inoculated culture medium. Three types of copper alloys were studied， which are HSn70-1A， HSn70-1B and HSn70-1AB. Biofilms formed on the surface of these copper alloys were different. The measurements of surface roughness indicated an asymmetrical structure of the biofilm， and HSn70-1AB has maximal surface roughness. Furthermore， the roughness of HSn70-1A is higher than HSn70-1B. Following the removal of biofilms，increase of roughness indicated the deterioration of copper alloys results from microbiologically influenced corrosion （MIC）. The capability of the AFM to produce quantitative information in the study of MIC was confirmed.

Key words： AEM microbiologically influenced corrosion biofilm

收稿日期: 2007-02-12

ZTFLH:

TG172.9

基金资助:

北京大唐国际电力有限公司资助(TX06-15)

通讯作者: 杜一立 jinli@bjtu.edu.cn

Corresponding author: DU Yili

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引用本文:

杜一立李进葛小鹏苑维双. 用原子力显微镜研究铜合金微生物的腐蚀行为[J]. 中国腐蚀与防护学报, 2008, 28(6期): 321-324.
DU Yi-Li, LI Jin, GE Xiao-Peng, YUN Wei-Shuang. AFM STUDY OF MICROBIOLOGICALLY INFLUENCED CORROSION OF COPPER ALLOYS. J Chin Soc Corr Pro, 2008, 28(6期): 321-324.

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y2008/V28/I6期/321

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