铜银系导电复合材料腐蚀失效研究

中国腐蚀与防护学报

2005, Vol. 25

Issue (4): 245-249

研究报告

本期目录 | 过刊浏览

铜银系导电复合材料腐蚀失效研究

朱华;甘复兴

武汉大学资源与环境科学学院

CORROSION FAILURE OF COMPLEX ELECTRICAL CONDUCTIVE MATIERALS FILLED WITH COPPER AND SILVER POWDERS

;

武汉大学资源与环境科学学院

全文: PDF(165 KB)

摘要: 采用无氰化学镀工艺，研制出一种导电性良好的镀银铜粉，粉末体积电阻率小于2×10-4Ω·cm，用该粉末为填料制成的导电胶，导电率高（导电填料与树脂的重量比为75：25时，体积电阻率为5×10-4Ω·cm）、抗迁移能力强（比银粉导电胶提高近百倍）、导电稳定（经60℃ 相对湿度100%湿热试验1000h，体积电阻率升高小于20%）.采用粉末微电极技术研究了导电胶抗迁移的机理，结果表明电偶效应是该导电胶具有抗迁移作用的主要原因，铜作为阳极抑制作为阴极的银的溶解，从而降低银形成枝晶的几率.

关键词 ：镀银铜粉, 导电胶, 腐蚀失效, 粉末微电极

Abstract：One new kind of silver-plated copper powder with high conductivity (volume resistivity of the powder is less than 2×10－4Ω·cm) was developed by the electroless plating without cyanide.The ECAs filled with this silver-plated copper powder exhibit high conductivity ( the volume resistivity of ECAs is less than 5×10－4Ω·cm when the mixing proportion of the resin to powder is 25:75 by weight) ,high migration-resistance (the shortcut time is 100 time longer than silver-filled ECAs in the migration test ) and high electric conductive stability (the volume esistivity increase is not more than 20% after 1000 hours humid-heat test in the condition of 60℃and RH100%).The mechanism of anti-migration was studied using powder microelectrode technique and other electrochemical methods.The results show galvanic coupling effect plays an important role in the anti-migration.Copper as anode restrains cathodic silver dissolved during dissolution then decreases the probability of dendritic growth.

Key words： silver-plated copper electrical conductive adhesive corrosion failure powder microelectrode

收稿日期: 2004-02-23

ZTFLH:

TG172

通讯作者: 朱华 E-mail: zhuhua67@sohu.com

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朱华; 甘复兴 . 铜银系导电复合材料腐蚀失效研究[J]. 中国腐蚀与防护学报, 2005, 25(4): 245-249 .
. CORROSION FAILURE OF COMPLEX ELECTRICAL CONDUCTIVE MATIERALS FILLED WITH COPPER AND SILVER POWDERS. J Chin Soc Corr Pro, 2005, 25(4): 245-249 .

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y2005/V25/I4/245

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