铜孔蚀的引发和扩展过程的研究

中国腐蚀与防护学报

1989, Vol. 9

Issue (1): 36-42

研究报告

本期目录 | 过刊浏览

铜孔蚀的引发和扩展过程的研究

张其滨;火时中

大连工学院;石油工业部施工技术研究所;大连工学院

A STUDY OF THE INITIATION AND PROPAGATION PROCESS OF PITTING CORROSION OF COPPER

Zhang Qibin and Huo Shizhong (Dalian Institute of Technology)

全文: PDF(688 KB)

摘要: 选用低 Cl~-、低 SO_4~(2-)浓度—高 HCO_3~-浓度的混合溶液,用电化学方法及表面分析技术研究了磷脱氧铜(TUP)的阳极极化行为及孔蚀引发和扩发过程。结果表明,铜在所用混合溶液中呈现典型的孔蚀特征;铜孔蚀的引发是由于 Cl~-进入表面膜并迁移到金属膜界面而导致局部破坏;铜孔蚀扩展的主要过程是 CuCl 的形成并水解,导致低 pH 值,并有 Cl~-浓集;铜的孔蚀具有自催化效应.

Abstract：The anodic polarization behaviour and the initiation and propagation processes of pitting corrosion of TUP copper have been studied by electro- chemical method and surface analysis technique in mixed solution of low Cl~- and SO_4~(2-) but high HCO_3~- concentrations.Copper shows typical pitting characteristics in this mixed solution.The initiation of pitting corrosion of copper is due to Cl~- ions entering surface film and migrating to metal/ film interface,resulting in local breakdown of film.The main process of pitting propagation of copper is the formation and hydrolysis of CuCl, resulting in low pH value and Cl~- enrichment with autocatalytic effect in pitting process.

收稿日期: 1989-02-25

基金资助:国家自然科学基金会

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引用本文:

张其滨;火时中. 铜孔蚀的引发和扩展过程的研究[J]. 中国腐蚀与防护学报, 1989, 9(1): 36-42.
. A STUDY OF THE INITIATION AND PROPAGATION PROCESS OF PITTING CORROSION OF COPPER. J Chin Soc Corr Pro, 1989, 9(1): 36-42.

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https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y1989/V9/I1/36

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