铜镍合金B-30在氯化钠介质中的电化学行为

中国腐蚀与防护学报

1986, Vol. 6

Issue (2): 103-112

研究报告

本期目录 | 过刊浏览

铜镍合金B-30在氯化钠介质中的电化学行为

张哲;姚禄安;甘复兴

武汉大学;武汉大学;武汉大学

ELECTROCHEMICAL BEHAVIOR OF Cu-Ni ALLOY IN SODIUM CHLORIDE SOLUTION

Zhang Zhe Yao Luan and Gan Fuxing(Wuhan University)

全文: PDF(675 KB)

摘要: 用电化学方法研究了铜镍合金B-30在氯化钠介质中的阳极和阴极过程。B-30的阳极过程受产(?)扩散控制,表面形成膜阻滞阳极过程;阴极过程是氧的还原,在腐蚀电位φ_c附近是活化控制。按此机理推导了求腐蚀电流Ic的动力学公式,并用计算机解析,求出了部份动力学参数。

Abstract：Anodic and cathodic processes of Cu-Ni alloy in 3％ NaCl solution have been investigated. Theanodic process is under diffusion controlled. The film Produced on the alloy surface inhibits theanodic process. Cathodic process is the reduction of oxygen on alloy. It is activation controlled near the corrosion potential(φ_c). An equatien for the corrosion kinetics of Cu-Ni alloy was derived and some kinetics parameters were calculated by computer.

收稿日期: 1986-04-25

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引用本文:

张哲;姚禄安;甘复兴. 铜镍合金B-30在氯化钠介质中的电化学行为[J]. 中国腐蚀与防护学报, 1986, 6(2): 103-112.
. ELECTROCHEMICAL BEHAVIOR OF Cu-Ni ALLOY IN SODIUM CHLORIDE SOLUTION. J Chin Soc Corr Pro, 1986, 6(2): 103-112.

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y1986/V6/I2/103

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