Corrosion Behavior of Ag/Sn Galvanic Couple at Applied Potential

doi:10.11902/1005.4537.2023.214

Journal of Chinese Society for Corrosion and protection

2024, Vol. 44

Issue (3): 700-706 DOI: 10.11902/1005.4537.2023.214

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Corrosion Behavior of Ag/Sn Galvanic Couple at Applied Potential

DAI Wei, LIU Yuanyuan, TU Wenrui, SUN Yangting(

), LI Jin, JIANG Yiming

Department of Materials Science, Fudan University, Shanghai 200438, China

Cite this article:

DAI Wei, LIU Yuanyuan, TU Wenrui, SUN Yangting, LI Jin, JIANG Yiming. Corrosion Behavior of Ag/Sn Galvanic Couple at Applied Potential. Journal of Chinese Society for Corrosion and protection, 2024, 44(3): 700-706.

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Abstract

In practical application, the selective oxidation of Ag₃Sn in Sn-Ag-Cu (SAC) solder will take place to form pure Ag, resulting in the formation of Ag/Sn galvanic couple. As development of electronic devices tends to miniature while high performance, the solder joints decrease in size, the in-between gaps become narrower, these factors lead to the increase in the intensity of the local electric field around solder joints. As a consequence, the corrosion behavior of SAC solder may change. In this paper, the corrosion of Ag/Sn galvanic couple under different applied potentials was studied by open-circuit potential and potentiodynamic polarization test and bipolar electrochemistry test. The results show that the OCP of Sn was lower than that of Ag. At high applied potential, Sn suffered severe corrosion while the formation of AgCl inhibited the dissolution of Ag; at low applied potential, Sn suffered cathodic corrosion.

Key words: bipolar electrochemistry SAC solder Ag corrosion Sn corrosion dendrite

Received: 07 July 2023 32134.14.1005.4537.2023.214

ZTFLH:

TG172

Fund: National Natural Science Foundation of China(52071082);Natural Science Foundation of Shanghai(21ZR1406500)

Corresponding Authors: SUN Yangting, E-mail: sunyangting@fudan.edu.cn

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	DAI Wei
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	SUN Yangting
	LI Jin
	JIANG Yiming

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https://www.jcscp.org/EN/10.11902/1005.4537.2023.214 OR https://www.jcscp.org/EN/Y2024/V44/I3/700

Fig.1 Schematic of bipolar electrochemistry test setup (a), top view (b) and side view (c) of bipolar electrode, ‘E’ represents the potential

Fig.2 OCP of Ag and Sn in 0.01 mol/L NaCl solution

Fig.3 Polarization curves of Ag and Sn in 0.01 mol/L NaCl solution

Fig.4 Optical image (a), SEM image (b), element distribution maps (c, d) and magnified views (e‒g) of Fig.4b, EDS results of points in Fig.4e-g (h‒j) of Ag after polarization in 0.01 mol/L NaCl solution

Fig.5 Optical image (a), SEM images (b, f), element distribution maps of Fig.5b (c‒e) and EDS result of points in Fig.5f (g, h) of Sn after polarization in 0.01 mol/L NaCl solution

Fig.6 SEM images and EDS results of the Ag (a1-a3) of zones 1, 2, and 3 in Fig.6a and Sn (b1-b3) of zones 1, 2, and 3 in Fig.6b after the BPE test for 10 min in 0.01 mol/L NaCl solution

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