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J Chin Soc Corr Pro  2008, Vol. 28 Issue (5): 307-310     DOI:
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Corrosion Behavior of Ni-P Deposit on W-Cu Alloy in NaCl Solution
武汉大学资源与环境工程学院环境工程系 湖北 武汉
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Abstract  The corrosion behavior of Ni-P deposit on W-Cu alloy in 3.5%(wt%) NaCl solution was tested by the polarization curves and electrochemical impedance spectroscopy (EIS). The results indicate that the passive region is not obvious after immersing in 3.5%(wt%) NaCl solution for 0.5 hour and with the increasing of the immersion time the passive membrane becomes integrated and the passive region is becoming obvious after immersing in 3.5%(wt%) NaCl solution for 2 days. After 6 days the point corrosion potential and passive region become smaller and its anti-corrosion ability is getting lower, but the passive parameter is better than that of W-Cu alloy. The polarization curves after immersing in 3.5%(wt%) NaCl solution for 13 days and 29 days were much the same as the one after 6 days and the corrosion behavior of Ni-P alloy in 3.5%(wt%) NaCl solution becomes stable.
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Received:  05 February 2007     
ZTFLH:  TG146  
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. Corrosion Behavior of Ni-P Deposit on W-Cu Alloy in NaCl Solution. J Chin Soc Corr Pro, 2008, 28(5): 307-310 .

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https://www.jcscp.org/EN/     OR     https://www.jcscp.org/EN/Y2008/V28/I5/307

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