STUDY ON ABSORPTION RATIO OF ALLOY ELEMENTS IN PLASMA Ni-Cr ALLOYING BY DOUBLE GLOW PLASMA PROCESS

J Chin Soc Corr Pro

1999, Vol. 19

Issue (6): 345-350 DOI:

Research Report

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STUDY ON ABSORPTION RATIO OF ALLOY ELEMENTS IN PLASMA Ni-Cr ALLOYING BY DOUBLE GLOW PLASMA PROCESS

Zhiyong He;;;

太原理工大学表面工程研究所

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Abstract Plasma Ni-Cr surface alloying was applied on mild steel by double Glow Plasma Surface Alloying Process.The sputtering and absorption of alloy elements,two basic processes that determined the kinetics of the alloying process,were investigated on the basis of discharge and sputtering theories and the experiment results.The study indicated that the alloying process was effected remarkably by the discharge parameters.The sputtering efficiency of the sputtering target was determined by the voltage applied on it and also the discharge pressure.High voltage and low discharge pressure and substrate bias should be chosen moderately to obtain the highest efficiency of the alloying process,the optimums being 40Pa and 400V respectively.Besides,the distance between sputtering target and substrate also affected the absorption ratio.Reduving distance was beneficial to the absorption process especially when it was at 20mm or shorter.The close correlation between the distance and the absorption ratio might result in the non-uniformity of the alloyed layer since it was inevitable that there would be some difference in the distance in practical operations.so the selection of distance should be considered in association with the specific processing condition.With certain sputtering supply of alloy elements,the larger the ratio of the absorption,the higher the quality of the alloyed layer.The absorption ratio should be the main concem with respect to the optimization of the rocessing coditions.

Key words: glow discharge sputtering surface alloying

Received: 31 December 1998

Corresponding Authors: Zhiyong He

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Zhiyong He. STUDY ON ABSORPTION RATIO OF ALLOY ELEMENTS IN PLASMA Ni-Cr ALLOYING BY DOUBLE GLOW PLASMA PROCESS. J Chin Soc Corr Pro, 1999, 19(6): 345-350 .

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https://www.jcscp.org/EN/ OR https://www.jcscp.org/EN/Y1999/V19/I6/345

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