Preparation of Micron SiC/Ni-Co-P Composite Coatings and Influencing Factors

doi:10.11902/1005.4537.2020.198

Journal of Chinese Society for Corrosion and protection

2021, Vol. 41

Issue (5): 579-584 DOI: 10.11902/1005.4537.2020.198

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Preparation of Micron SiC/Ni-Co-P Composite Coatings and Influencing Factors

ZHANG Chenyang¹, LIU Huicong¹, HAN Dongxiao², ZHU Liqun¹, LI Weiping¹(

)

^1.School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
^2.Beijing Shiny Tech. Co. Ltd. , Beijing 100039, China

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Abstract

Micron graded SiC/Ni-Co-P composite coating, as a substitute for Cr-plating was successfully prepared on 9Cr2Mo steel by galvanostatic deposition. On this basis, the effect of bath composition on the macro- and micro-morphology, composition and microhardness of the coating was assessed through single factor experiments. The results show that the acquired SiC/Ni-Co-P composite coating presents hardness of 646.11 (HV); the SiC/Ni-Co-P composite coating incorporated with strongly electronegative micron grade SiC particles has smoother surface with less microcracks but without pores, and the particle content is higher than that with electropositive and weak electric SiC particles. The process and interface behavior of the incorporated micro SiC particles in the coating by electrodeposition were investigated, and the effect of surface treatment of micron SiC on the coating was also interpreted.

Key words: silicon carbide nickel matrix composite silicon carbide modification nickel base alloy electrodeposition silicon carbide content

Received: 19 October 2020

ZTFLH:

TQ153

Fund: National Key Research and Development Project(2018YFB2002000);National Natural Science Foundation of China(U1637204)

Corresponding Authors: LI Weiping E-mail: liweiping@buaa.edu.cn

About author: LI Weiping, E-mail: liweiping@buaa.edu.cn

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Cite this article:

ZHANG Chenyang, LIU Huicong, HAN Dongxiao, ZHU Liqun, LI Weiping. Preparation of Micron SiC/Ni-Co-P Composite Coatings and Influencing Factors. Journal of Chinese Society for Corrosion and protection, 2021, 41(5): 579-584.

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https://www.jcscp.org/EN/10.11902/1005.4537.2020.198 OR https://www.jcscp.org/EN/Y2021/V41/I5/579

Fig.1 Coating surface (a~c) and SEM (d~f) images of electrodeposited SiC/Ni-Co-P films at 250 g/L (a, d), 300 g/L (b, e) and 350 g/L (c, f) concentration of NiSO₄

Fig.2 Coating surface (a~c) SEM (d~f) images of electrodeposited SiC/Ni-Co-P films at 20 g/L (a, d), 30 g/L (b, e) and 40 g/L (c, f) concentration of NiCl₂

Fig.3 SEM images of electrodeposited SiC/Ni-Co-P films at 5 g/L (a), 10 g/L (b), 20 g/L (c), 30 g/L (d), 50 g/L (e) and 70 g/L (f) concentration of SiC

Fig.4 Influence of SiC concentration on mass fraction of Si and hardness of coating

Fig.5 Particle size distribution of SiC after treatment with different ionic surfactants

Fig.6 Zeta potential of SiC after treatment with different ionic surfactants

Fig.7 SEM images of composite coating when SiC after treatment with SDBS (a), PVP (b), CTAB (c) andnone (d) ionic surfactants

Table 1 Atomic percentage of elements in different coatings

Fig.8 SEM images of growth of crystal nucleus on SiC surface (a) and SiC is embedded by coating (b)

1	Qin Q X, Guo H T, Liu S L, et al. Principle and Process of Electroplating [M]. 2nd ed. Tianjin: Tianjin Science and Technology Press, 1993: 65
	覃奇贤, 郭鹤桐, 刘淑兰等. 电镀原理与工艺 [M]. 2版. 天津: 天津科学技术出版社, 1993: 65
2	Mandich N V. Practical problems in bright and hard chromium electroplating—Part I [J]. Met. Finish., 1999, 97: 100
3	Fujita M, Jomjunyong S, Itoh Y. Predicting service life of a bright Ni-Cr electroplating system on steel subjected to the CASS test [J]. Trans. IMF, 1997, 75: 98
4	Weng Y H. New Electroplating Process [M]. Hangzhou: Zhejiang Science and Technology Press, 1988: 69
	翁元浩. 电镀新工艺 [M]. 杭州: 浙江科学技术出版社, 1988: 69
5	Subramanian B, Mohan S, Jayakrishnan S. Selective area deposition of Tin-Nickel alloy coating-an alternative for decorative chromium plating [J]. J. Appl. Electrochem., 2007, 37: 219
6	El-Sharif M, Chisholm C U. Characteristics of electrodeposited chromium [J]. Trans. IMF, 1997, 75: 208
7	Snyder D L. Decorative chromium plating [J]. Met. Finish., 2001, 99: 215
8	El-Sharif M. Replacing hexavalent chromium in electroplating [J]. Trans. Inst. Met. Finish., 1997, 75: B143
9	Zhu L Q, Xue Z, Wu K H. Effect of electroplating process on color of Ni-W decorative deposits alternative to chromium [J]. J. Jiangsu Univ. (Nat. Sci. Ed.), 2008, 29: 34
	朱立群, 薛振, 吴坤湖. 电镀工艺对Ni-W装饰性代铬镀层色泽的影响 [J]. 江苏大学学报 (自然科学版), 2008, 29: 34
10	Haseeb A S M A, Arita M, Hayashi Y. Thermal decomposition study of electrodeposited Fe-C and Fe-Ni-C alloys by differential scanning calorimetry [J]. J. Mater. Sci., 2001, 36: 4739
11	Panagopoulos C N, Plainakis G D, Lagaris D A. Nanocrystalline Ni-W coatings on copper [J]. Mater. Sci. Eng., 2011, 176B: 477
12	Pushpavanam M, Manikandan H, Ramanathan K. Preparation and characterization of nickel-cobalt-diamond electro-composites by sediment co-deposition [J]. Surf. Coat. Technol., 2007, 201: 6372
13	Wang J C, Cheng X D, Li D H, et al. Study on Ni-W-SiC nanometer electrodeposition process [J]. J. Mater. Eng., 2006, (3): 25
	王晋春, 程旭东, 李丹虹等. Ni-W-SiC纳米复合电镀工艺的研究 [J]. 材料工程, 2006, (3): 25
14	Lee E C, Choi J W. A study on the mechanism of formation of electrocodeposited Ni-diamond coatings [J]. Surf. Coat. Technol., 2001, 148: 234
15	Shi L, Sun C F, Zhou F, et al. Electrodeposited nickel-cobalt composite coating containing nano-sized Si₃N₄ [J]. Mater. Sci. Eng., 2005, 397A: 190
16	Wang F, Yu H Y, Sun D B, et al. Study on the wear resistance performance of Ni-P-nano-Al₂O₃ composite coatings [J]. Electroplat. Finish., 2007, 26(3): 1
	王芳, 俞宏英, 孙冬柏等. Ni-P-纳米Al₂O₃复合镀层耐磨性能研究 [J]. 电镀与涂饰, 2007, 26(3): 1
17	Surender M, Basu B, Balasubramaniam R. Wear characterization of electrodeposited Ni-WC composite coatings [J]. Tribol. Int., 2004, 37: 743
18	Yu J, Liu J P, Zhao G P, et al. Pyro-oxidation resistance of Ni-SiC nano-composite coating [J]. Surf. Technol., 2004, 33(6): 31
	于杰, 刘建平, 赵国鹏等. Ni-SiC纳米复合镀层的耐高温氧化性能 [J]. 表面技术, 2004, 33(6): 31

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