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| Effect of 1.10-phenanthroline on Electroless Copper Plating Using Formaldehyde as Reductant |
| ZHAO Qing, ZHANG Chuanbo, WANG Shuaixing, DU Nan, ZHAO Lin, LI Yuanyuan |
| National Defense Key Disciplines Laboratory of Light Alloy Processing Science and Technology, Nanchang Hangkong University, Nanchang 330063, China |
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Abstract The effects of 1.10-phenanthroline on the utilization of formaldehyde and copper deposition behavior during electroless copper plating was studied by measurement of the formaldehyde in electrolyte in real-time, polarization curves, electrochemical impedance spectroscopy (EIS) and scanning Kelvin probe (SKP). The morphology and microstructure of copper coating was characterized by SEM and XRD. The results showed that 1.10-phenanthroline can accelerate the oxidation of formaldehyde and increase the utilization of formaldehyde. When 1.10-phenanthroline was added to electrolyte, the resistance of electrolyte reduced, the current density at mixed potential increased, the surface potential of copper at electrolyte moved negatively, and then the copper deposition rate increased. The utilization of formaldehyde rose from 28% to 39%, the deposition rate increased by 50% when 1.5 mgL-1 1.10-phenanthroline was added to electrolyte. Besides, 1.10-phenanthroline is helpful to obtain uniform and fine copper coating, and increases the preferred orientation of Cu(111).
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Received: 31 December 2012
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Cite this article:
ZHAO Qing,ZHANG Chuanbo,WANG Shuaixing,DU Nan,ZHAO Lin,LI Yuanyuan. Effect of 1.10-phenanthroline on Electroless Copper Plating Using Formaldehyde as Reductant. Journal of Chinese Society for Corrosion and protection, 2013, 33(6): 515-520.
URL:
https://www.jcscp.org/EN/ OR https://www.jcscp.org/EN/Y2013/V33/I6/515
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