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| CORROSION BEHAVIOR OF Cu-Ni-Sn ALLOY UNDER SULFATE-REDUCING BACTERIABIOFILM |
| CHEN Juan1, LEI Yanhua1, GAO Guanhui1, KONG Moli1, YIN Yansheng2 |
1. Institute of Materials Science and Engineering, Ocean University of China, Qingdao 266100
2. Institute of Marine Materials Science and Engineering, Shanghai Maritime University, Shanghai 201306 |
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Abstract The effect of sulfate - reducing bacteria (SRB) on corrosion behavior of Cu-Ni-Sn alloy were studied using open circuit potential, polarization curve and electrochemical impedance spectroscopy (EIS) methods. Scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS) were utilized to investigate the corrosion morphologies of Cu-Ni-Sn alloy. The open circuit potential of the alloy in condition with SRB decreased from -275 mV to -750 mV and nearly 650 mV lower than that of which without SRB (-100 mV). SEM results showed that an uneven biofilm occurred on the alloy surface and there were pitting corrosion and crevice corrosion. EDS analysis indicates that denickelification and detinning corrosion occurred and the corrosion products were copper and nickel sulfide. Therefore, the corrosion of Cu-Ni-Sn alloy accelerated under the biofilm of SRB.
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Received: 29 March 2010
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| Fund: 2008BS09013 |
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Corresponding Authors:
YIN Yansheng
E-mail: yys2003@ouc.edu.cn
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