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J Chin Soc Corr Pro  2009, Vol. 29 Issue (2): 104-108    DOI:
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ELECTROCHEMICALLY PREPARED PATTERN\par OF ANODIC ALUMINA
HAN Yu; XIE Kai
Department of Materials Engineering and Applied Chemistry;National University of Defense Technology;Changsha 410073
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Abstract  

Soft lithography and anodic process were combined to prepare the pattern porous alumina successfully. The experiments showed that the spacing after monomer volatilizing during polymerization and the cavity produced by thermal motion of segment were the key factors to weaken the protection of film. In addition, the thickness of which should be thinner than the max height of polymer spread by the capillary force.

Key words:  pattern;anodic alumina;polystyrene     
Received:  24 July 2007     
ZTFLH: 

O78

 
Corresponding Authors:  HAN Yu     E-mail:  yumihan1981@yahoo.com.cn

Cite this article: 

HAN Yu XIE Kai. ELECTROCHEMICALLY PREPARED PATTERN\par OF ANODIC ALUMINA. J Chin Soc Corr Pro, 2009, 29(2): 104-108.

URL: 

https://www.jcscp.org/EN/     OR     https://www.jcscp.org/EN/Y2009/V29/I2/104

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