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| CORROSION BEHAVIOR OF TIN-ZINC BASED ALLOY SOLDER |
| Zhidong Xia;Nan Mu;Yaowu Shi |
| 北京工业大学材料学院 |
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Abstract Environmental concerns drive market to find environ ment-friendly solder to replace the lead-bearing solder for microelectronic join ing.In this paper,the corrosion behavior of Sn-37Pb and SnZn based lead-free sol ders(including Sn-9Zn,Sn-9Zn-0.25RE) has been investigated.Mass loss evaluati on,observation of corrosion morphology by scanning electron microscope(SEM) and electrochemical testing has been conducted on.The corrosion experiments were un dertaken in tap water(room temperature),tap water(70℃),in air with high humid ity at high temperature(70℃) and in 3% NaCl solution at room temperature separ ately.The results reveal that:SnPb solder was corroded uniformly under the all c orrosion conditions mentioned in the paper.The corrosion products are likely to peeling off from the matrix for their weak joining.SnZn based solder is characte ristics with chosen corrosion of zinc for the low standard potential of zinc,res ulting in pitting of the alloy.The corrosion mechanism of this zinc-bearing sold er is a mixing of pitting and entire corrosion,leading to fast corrosion rate.Mi nimal rare-earth elements in SnZnRE solder improve the compactness of the micros tructure of SnZn alloy and its corrosion products,resulting in the slow corrosio n rate and stronger corrosion-resistance of SnZnRE solder.Based on the above exp eriments,Sn-Zn based solder will be expected to replace the SnPb solder when its competitive properties meet the required touchstones.
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Received: 08 November 2001
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Corresponding Authors:
Zhidong Xia
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