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| THE STRUCTURE AND HIGH TEMPERATURE STABILITY OF Ti-N FILM AS A DIFFUSION BARRIER |
| Wang Jiajun(Tsinghua University)Sun Yufang(Central Non-Reffous Research Institute)Ye Ruizeng(University of Science and Technology Beijing) |
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Abstract The surface morphology, structure and high temperature stability of multi-arc plated Ti-N film as a diffusion barrier on nickel-based alloy GH220 have been studied. A lot of palticales which are found on surface of the Ti-N film have great influence on the structure and properties of the magnetic-controlled sputtered MCrAIX coating overlaying the Ti-N film. X-ray diffraction analysis indicates that the Ti-N film consists of δ-TiN, ε-Ti2N, α-Ti, etc. The δ-TiN in the Ti-N film has a strongly preferred {111} orientation, but the preference disappears after the film is diffusion-annealed. Experimental results of aging at 1000℃ demonstrate that the Ti-N film is of good high temperature stability, and the elemental Ti in Ti-N film does not inter-diffuse towards either GH220 alloy or MCrAIX coating. Thus it could be concluded that Ti-N film can be used as a diffusion barrier to prevent the alloying elements from inter-diffusion or slow down the rate of inter-diffusion of alloying elements between the substrate and MCrAIX coating.
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Received: 25 June 1994
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Cite this article:
Wang Jiajun(Tsinghua University)Sun Yufang(Central Non-Reffous Research Institute)Ye Ruizeng(University of Science and Technology Beijing). THE STRUCTURE AND HIGH TEMPERATURE STABILITY OF Ti-N FILM AS A DIFFUSION BARRIER. J Chin Soc Corr Pro, 1994, 14(3): 247-251.
URL:
https://www.jcscp.org/EN/ OR https://www.jcscp.org/EN/Y1994/V14/I3/247
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