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J Chin Soc Corr Pro  1987, Vol. 7 Issue (1): 8-18    DOI:
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AN ANALYSIS ON GROWTH KINETICS OF THE INTERMETALLIC LAYER IN 55% Al—Zn HOT—DIPPING PRO CESS
Meng Rongxiang Yang Xizhen (Shandong polyfechnic University)
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Abstract  The growth kinetics of the intermetallic layer formed in 55% Al-Zn hot-dipping bath has been analysed. A model of the growth kinetics and its calculation method have been presented. Based on the experimental results of A3 steel in the bathes containing various amounts of silicon, the growth relations of the intermetallie layer and the activation energies of diffusion have been found out by curve-fitting method with a computer. Furthermore, the mechanism of the effect of silicon in the bath has also been discussed preliminarily.
Received:  25 February 1987     
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Meng Rongxiang Yang Xizhen (Shandong polyfechnic University). AN ANALYSIS ON GROWTH KINETICS OF THE INTERMETALLIC LAYER IN 55% Al—Zn HOT—DIPPING PRO CESS. J Chin Soc Corr Pro, 1987, 7(1): 8-18.

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https://www.jcscp.org/EN/     OR     https://www.jcscp.org/EN/Y1987/V7/I1/8

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