纯铜双层辉光离子渗钛高温氧化性能的研究

中国腐蚀与防护学报

2004, Vol. 24

Issue (3): 139-142

研究报告

本期目录 | 过刊浏览

纯铜双层辉光离子渗钛高温氧化性能的研究

张跃飞

北京印刷学院等离子体物理及材料实验室

High Temperature Oxidation Resistance of the Plasma Titanizing on Copper Surface by Double Glow Discharge

Yuefei Zhang

北京印刷学院等离子体物理及材料实验室

全文: PDF(211 KB)

摘要: 采用双层辉光离子渗金属技术，在纯铜表面形成均匀的渗钛层.对离子渗钛试样和纯铜试样在400℃和700℃进行了高温氧化对比实验，分别给出了它们的氧化动力学曲线，用扫描电子显微镜观察分析氧化表面形貌，结果表明纯铜表面离子渗钛后提高了高温抗氧化的性能，降低了氧化速率，离子渗钛层的氧化膜致密，对继续氧化有阻碍作用.

关键词 ：离子渗钛, 纯铜, 高温氧化性能

Abstract：Double glow discharge is applied to pure copper substrate to obtaintitanizing alloying layer.The high temperature oxidation resistance of the plasma titanizing samples at 400℃ and 700℃ wasinvestigated.The oxidation kineticscurve was worked out.The morphologies of oxidation surface were observed and analyzed with a scanning electron microscope and the oxidation mechanism was ssed.The results show that plasma titanizing on copper surface can improve greatly the high temperatureoxidation resistance of copper.The oxidation rate of copper is less than that of plasma titanizing.The oxidation film of plasma titanizing sample is very dense and is not easily exfoliated.The dense oxidation film prevents the copper from more oxidation.

Key words： plasma titanizing pure copper high temperature oxidation resistance

收稿日期: 2002-10-16

ZTFLH:

TG172.82

通讯作者: 张跃飞

Corresponding author: Yuefei Zhang

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引用本文:

张跃飞 . 纯铜双层辉光离子渗钛高温氧化性能的研究[J]. 中国腐蚀与防护学报, 2004, 24(3): 139-142 .
Yuefei Zhang. High Temperature Oxidation Resistance of the Plasma Titanizing on Copper Surface by Double Glow Discharge. J Chin Soc Corr Pro, 2004, 24(3): 139-142 .

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y2004/V24/I3/139

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