镓对液态共晶锡铅焊料抗氧化性的影响

中国腐蚀与防护学报

1988, Vol. 8

Issue (4): 318-323

研究报告

本期目录 | 过刊浏览

镓对液态共晶锡铅焊料抗氧化性的影响

吴申庆;姜文标

南京工学院;南京工学院

INFLUENCE OF Ga ON ANTI—OXIDATION OF MOLTEN EUTECTIC Sn-Pb SOLDER

Wu Shenqing and Jiang Wenbiao (Nanjing Institute of Technoloqy)

全文: PDF(489 KB)

摘要: <正> 一、前言锡铅焊料是电子、通讯、航空等工业广泛使用的钎焊材料。目前使用的含锡61％、含铅39％的共晶合金焊料(HLSnPb39)在液态下暴露于空气中会产生大量氧化渣,不仅造成锡消耗增加,而且影响自动焊接的质量。据统计仅全国电子工业每年因此而造成的经济损失达七千余万元。

Abstract：Under conditions of simulating dip-soldering and wave-soldering, the oxidizability and solderability of molten NG solder developed recently by the authors were investigated and compared with those of HLSnPb39 and H63A solders made in Japan. The drossing weight of NG solder was about onefourth of that of HLSnPb 39 or H63A solder, which showed that NG solder was better than the other two solders in anti-oxidation. Experiments also showed that the wettability of NG solder was 40％ larger than that of HLSnPb39 solder. Results examined by SEM and AES show that the additional element Ga is highly enriched on the surface of NG solder. A dense and very thin film exists on the surface.

收稿日期: 1988-08-25

	服务

	把本文推荐给朋友
	加入引用管理器
	E-mail Alert
	RSS
	作者相关文章
	吴申庆
	姜文标
44.8K

引用本文:

吴申庆;姜文标. 镓对液态共晶锡铅焊料抗氧化性的影响[J]. 中国腐蚀与防护学报, 1988, 8(4): 318-323.
. INFLUENCE OF Ga ON ANTI—OXIDATION OF MOLTEN EUTECTIC Sn-Pb SOLDER. J Chin Soc Corr Pro, 1988, 8(4): 318-323.

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y1988/V8/I4/318

[1] 江苏电子工业综合技术研究所,电子元器件可焊性资料汇编,(1982)
[2] Scully, J. C., The Fundamentals of Corrosion, Pergamon International Liberary, (1975)
[3] Evans, U.R., The Corrosion and Oxidation of Metals, London, P.789, (1960)
[4] Stoneman, A.M.; Mackay, C.A.; Thwaites, C. J., (?)ation and Drossing of Molten Solders: Effects of Impurities, Metals Tech. 7, 226 (1980)
[5] Hoar, T. P.; Price, L. E., Trans. Faraday Soc. 867 (1938)

No related articles found!

Viewed

Full text

Abstract

Cited

Shared

Discussed