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| 有机硅对电子器件加速腐蚀失效行为机理研究 |
| 李嘉欣, 张雨萌, 廖伟, 孙鹏, 朱琦, 周鹏, 张涛, 王福会 |
1.东北大学数字钢铁全国重点实验室,沈阳 110819;
2.东北大学,材料各向异性与织构重点实验室,沈阳 110819
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| Study on the Mechanism of Accelerated Corrosion Failure Behavior of Electronic Devices Induced by Organosilicon Material |
1.State Key Laboratory of Digital Steel, Northeastern
University, Shenyang 110819, China.
2.Key Laboratory of Materials Anisotropy and Texture,
Northeastern University, Shenyang 110819, China.
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引用本文:
李嘉欣, 张雨萌, 廖伟, 孙鹏, 朱琦, 周鹏, 张涛, 王福会. 有机硅对电子器件加速腐蚀失效行为机理研究[J]. 中国腐蚀与防护学报, 10.11902/1005.4537.2026.193.
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Study on the Mechanism of Accelerated Corrosion Failure Behavior of Electronic Devices Induced by Organosilicon Material[J]. Journal of Chinese Society for Corrosion and protection, 0, (): 0-.
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