| Electroplating | ① Low process costs | ① Prone to defects |
| ② High hardness | ② Generating hazardous substances during the process |
| Thermal spray | ① Wide choice of coating materials | ① The coating and the substrate are mainly mechanically bonded, and the bonding strength is weak |
| ② Good overall performance | ② Cracks may occur when unmelted powder hits the substrate at high speeds |
| Laser cladding | ① Metallurgical bonding of the coating to the substrate | ① The coating is susceptible to cracking due to thermal stress |
| ② Good density | |
| Arc melting copper | ① Metallurgical bonding of the coating to the substrate | ① High equipment costs |
| ② Good electrical conductivity, thermal conductivity, self-lubricating properties | ② Single copper coating performance is weak, need to add other alloying elements |