烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究

王康, 姜建军, 杨丽景, 宋振纶

Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface

WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun

表2 单一变量实验的对象和条件

Table 2 Subjects and conditions of single variable experiment

Ingredient and condition Variable 1 Variable 2 Variable 3 Variable 4 Variable 5 Variable 6 Variable7 CuSO4·5H2O / g·L-1 15 20 22.5 25 30 35 40 HEDP / g·L-1 50 60 70 80 - - - K4P2O7 / g·L-1 10 20 40 60 - - - Current density / A·dm-2 0.3 0.6 0.9 1.2 1.5 - - pH 8 9 10 11 - - - Temperature / ℃ 30 40 50 60 - - -