烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究 |
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| 王康, 姜建军, 杨丽景, 宋振纶 | ||||||||||||||||||
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Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface |
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| WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun | ||||||||||||||||||
| 表1 电镀Cu的溶液组成及实验条件 |
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| Table 1 Bath composition and experimental conditions for copper plating |
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