烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究

王康, 姜建军, 杨丽景, 宋振纶

Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface

WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun

图13 Cu镀层的划格实验

Fig.13 Scratch tests of Cu plating before (a) and after (b) adhesive tape stripping