烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究 |
| 王康, 姜建军, 杨丽景, 宋振纶 |
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Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface |
| WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun |
| 图12 纯Cu镀层的截面形貌 |
| Fig.12 Cross-sectional morphology of pure Cu plating |
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