烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究

王康, 姜建军, 杨丽景, 宋振纶

Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface

WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun

图10 含有不同辅助络合剂的镀液所得到的镀层SEM形貌

Fig.10 SEM morphologies of the coatings deposited in the plating solutions containing the auxiliary complexing agents of potassium citrate (a), potassium sodium tartrate (b), TEA (c) and EDTA (d)