烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究
Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface
烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究 |
| 王康, 姜建军, 杨丽景, 宋振纶 |
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Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface |
| WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun |
| 图8 不同电流密度下的镀层表面SEM形貌 |
| Fig.8 SEM surface morphologies of the coatings deposited at different current densities: (a) 0.6 A·dm-2, (b) 0.9 A·dm-2, (c) 1.2 A·dm-2, (d) 1.5 A·dm-2 |
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