烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究

王康, 姜建军, 杨丽景, 宋振纶

Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface

WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun

图5 在含不同HEDP和焦磷酸钾浓度的镀液中所沉积镀层的表面SEM形貌

Fig.5 SEM surface morphologies of the coatings deposited in the baths containing 50 g·L-1 (a1), 60 g·L-1 (a2), 70 g·L-1 (a3), 80 g·L-1 (a4) HEDP and 10 g·L-1 (b1), 20 g·L-1 (b2), 40 g·L-1 (b3),60 g·L-1 (b4) potassium pyrophosphate