烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究
Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface
烧结NdFeB表面HEDP-焦磷酸钾体系电镀铜工艺及性能研究 |
| 王康, 姜建军, 杨丽景, 宋振纶 |
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Copper Electroplating Process and Performance of HEDP-potassium Pyrophosphate System on Sintered NdFeB Surface |
| WANG Kang, JIANG Jianjun, YANG Lijing, SONG Zhenlun |
| 图3 HEDP电镀体系pH滴定过程 |
| Fig.3 Titration curves of the baths containing different concentrations of CuSO4 (a) and solution states during titration (b) |
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